Neural Networks Without Matrix Math

By Katherine Derbyshire - 17 Sep, 2020 - Comments: 0

The challenge of speeding up AI systems typically means adding more processing elements and pruning the algorithms, but those approaches aren't the only path forward. Almost all commercial machine learning applications depend on artificial neural networks, which are trained using large datasets with a back-propagation algorithm. The network first analyzes a training example, typically assign... » read more

How ML Enables Cadence Digital Tools To Deliver Better PPA

By Cadence - 09 Sep, 2020 - Comments: 0

Artificial intelligence (AI) and machine learning (ML) are emerging as powerful new ways to do old things more efficiently, which is the benchmark that any new and potentially disruptive technology must meet. In chip design, results are measured in many different ways, but common metrics are power (consumed), performance (provided), and area (required), collectively referred to as PPA. These me... » read more

From Data Center To End Device: AI/ML Inferencing With GDDR6

By Rambus - 09 Sep, 2020 - Comments: 0

Created to support 3D gaming on consoles and PCs, GDDR packs performance that makes it an ideal solution for AI/ML inferencing. As inferencing migrates from the heart of the data center to the network edge, and ultimately to a broad range of AI-powered IoT devices, GDDR memory’s combination of high bandwidth, low latency, power efficiency and suitability for high-volume applications will be i... » read more

Challenges In Using AI In Verification

By Ann Mutschler - 27 Aug, 2020 - Comments: 0

Pressure to use AI/ML techniques in design and verification is growing as the amount of data generated from complex chips continues to explode, but how to begin building those capabilities into tools, flows and methodologies isn't always obvious. For starters, there is debate about whether the data needs to be better understood before those techniques are used, or whether it's best to figure... » read more

Artificial Intelligence And Machine Learning Add New Capabilities to Traditional RF EDA Tools

By Cadence - 26 Aug, 2020 - Comments: 0

This article features contributions from RF EDA vendors on their various capabilities for artificial intelligence and machine learning. AWR Design Environment software is featured and highlights the network synthesis wizard. Click here to continue reading. » read more

Finding Defects With E-Beam Inspection

By Mark LaPedus - 20 Aug, 2020 - Comments: 0

Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these new e-beam inspection systems. One is a more traditional approach, which uses a single-beam e-beam system. Others, meanwhile, are developing newer multi-beam technology. Both approaches have thei... » read more

Scaling AI/ML Training Performance With HBM2E Memory

By Frank Ferro - 13 Aug, 2020 - Comments: 0

In my April SemiEngineering Low Power-High Performance blog, I wrote: “Today, AI/ML neural network training models can exceed 10 billion parameters, soon it will be over 100 billion.” “Soon” didn’t take long to arrive. At the end of May, OpenAI unveiled a new 175-billion parameter GPT-3 language model. This represented a more that 100X jump over the size of GPT-2’s 1.5 billion param... » read more

Customization And Limitations At The Edge

By Ed Sperling - 10 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the edge constraints and the need for security with Jeff DeAngelis, managing director of the Industrial and Healthcare Business Unit at Maxim Integrated; Norman Chang, chief technologist at Ansys; Andrew Grant, senior director of artificial intelligence at Imagination Technologies; Thomas Ensergueix, senior director of the automotive and IoT line of... » read more

Big Changes In AI Design

By Ed Sperling And Susan Rambo - 06 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss AI and its move to the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus; Kris Ardis, executive director at Maxim Integrated; Steve Roddy, vice president of Arm's Products Learning Group; and Vinay Mehta, inference technical marketing manager at Flex Logix. What follows are excerpts of that ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 31 Jul, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT, 5G Qualcomm settled its 5G licensing disagreement with Huawei, which will pay $1.8 billion in back royalties and will pay for licensing going forward. Huawei is also now the world’s largest supplier of smartphones, surpassing Samsung Electronics Co. Qualcomm also announced a super-fast charging platform this week for Android devices that is sup... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: machine learning