tag: machine learning

From Data Center To End Device: AI/ML Inference With GDDR6
By Rambus - 03 May, 2023 - Comments: 0

Created to support 3D gaming on consoles and PCs, GDDR packs performance that makes it an ideal solution for AI/ML inference. As inference migrates from the heart of the data center to the network edge, and ultimately to a broad range of AI-powered IoT devices, GDDR memory’s combination of high bandwidth, low latency, power efficiency and suitability for high-volume applications will be incre... » read more

ML-Based Third-Party IP Trust Verification Framework (U. of Florida, U. of Kansas)
By Technical Paper Link - 01 May, 2023 - Comments: 0

A technical paper titled "Hardware IP Assurance against Trojan Attacks with Machine Learning and Post-processing" was published by researchers at University of Florida and University of Kansas. Abstract: "System-on-chip (SoC) developers increasingly rely on pre-verified hardware intellectual property (IP) blocks often acquired from untrusted third-party vendors. These IPs might contain hidd... » read more

AI Adoption Slow For Design Tools
By Brian Bailey - 01 May, 2023 - Comments: 0

A lot of excitement, and a fair amount of hype, surrounds what artificial intelligence (AI) can do for the EDA industry. But many challenges must be overcome before AI can start designing, verifying, and implementing chips for us. Should AI replace the algorithms in use today, or does it have a different role to play? At the end of the day, AI is a technique that has strengths and weaknesses... » read more

EDA Makes A Frenzied Push Into Machine Learning
By Ed Sperling - 27 Apr, 2023 - Comments: 0

Machine learning is becoming a competitive prerequisite for the EDA industry. Big chipmakers are endorsing and demanding it, and most EDA companies are deploying it for one or more steps in the design flow, with plans to add much more over time. In recent weeks, the three largest EDA vendors have made sweeping announcements about incorporating ML into their tools at their respective user eve... » read more

Hyperscale HW Optimized Neural Architecture Search (Google)
By Technical Paper Link - 21 Apr, 2023 - Comments: 0

A new technical paper titled "Hyperscale Hardware Optimized Neural Architecture Search" was published by researchers at Google, Apple, and Waymo. "This paper introduces the first Hyperscale Hardware Optimized Neural Architecture Search (H2O-NAS) to automatically design accurate and performant machine learning models tailored to the underlying hardware architecture. H2O-NAS consists of three ... » read more

100G Ethernet At The Edge
By Ed Sperling - 19 Apr, 2023 - Comments: 0

The amount of data is growing, and so is the need to process it closer to the source. The edge is a middle ground between the cloud and the end point, close enough to where data is generated to reduce the time it takes to process that data, yet still powerful enough to analyze that data quickly and send it wherever it is needed. But to make this all work requires faster conduits for that data i... » read more

How Chip Engineers Plan To Use AI
By Ed Sperling - 19 Apr, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how AI is being used today and how engineers expect to use it in the future, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta; and David Pan, professor in the ... » read more

Nightmare Fuel: The Hazards Of ML Hardware Accelerators
By Steve Roddy - 13 Apr, 2023 - Comments: 0

A major design challenge facing numerous silicon design teams in 2023 is building the right amount of machine learning (ML) performance capability into today’s silicon tape out in anticipation of what the state of the art (SOTA) ML inference models will look like in 2026 and beyond when that silicon will be used in devices in volume production. Given the continuing rapid rate of change in mac... » read more

Using Machine Learning To Increase Yield And Lower Packaging Costs
By Melvin Lee - 11 Apr, 2023 - Comments: 0

Packaging is becoming more and more challenging and costly. Whether the reason is substrate shortages or the increased complexity of packages themselves, outsourced semiconductor assembly and test (OSAT) houses have to spend more money, more time and more resources on assembly and testing. As such, one of the more important challenges facing OSATs today is managing die that pass testing at the ... » read more

Autonomous Driving: End-to-End Surround 3D Camera Perception System (NVIDIA)
By Technical Paper Link - 10 Apr, 2023 - Comments: 0

A new technical paper titled "NVAutoNet: Fast and Accurate 360∘ 3D Visual Perception For Self Driving" was published by researchers at NVIDIA. Abstract "Robust real-time perception of 3D world is essential to the autonomous vehicle. We introduce an end-to-end surround camera perception system for self-driving. Our perception system is a novel multi-task, multi-camera network which takes a... » read more

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