Blog Review: Jan. 17

By Jesse Allen - 17 Jan, 2018 - Comments: 0

Mentor's Puneet Sinha identifies the key challenges, along with cost reduction and optimization opportunities, that come with using electric powertrains in autonomous vehicles. Synopsys' Robert Vamosi examines the impact of limited cellular networks on autonomous cars, and new communications protocols that could address coverage gaps. Cadence's Paul McLellan listens in as Lucian Shifren o... » read more

Getting Serious About Chiplets

By Ann Mutschler - 08 Jan, 2018 - Comments: 0

Demand for increasingly complex computation, more features, lower power, and shorter lifecycles are prompting chipmakers to examine how standardized hard IP can be used to quickly assemble systems for specific applications. The idea of using chiplets, with or without a package, has been circulating for at least a half-dozen years, and they can trace their origin back to IBM's packaging schem... » read more

Reshaping Automotive Design

By Ann Mutschler - 04 Jan, 2018 - Comments: 0

The entire automotive ecosystem is being reshaped by vehicle electrification, assisted and autonomous driving, and the connectivity needed to make it all work. So far, it's not clear just how smoothly this will all come together. In this redefined world, electronics and software will provide differentiation rather than mechanical engineering and possibly even brand name, creating change on a... » read more

HPC Case Study: CFD Applications On ARM

By Arm - 20 Dec, 2017 - Comments: 0

In this paper, we examine the readiness and potential of ARM-based platforms for High Performance Computing, and have benchmarked two different computational fluid dynamics (CFD) applications. CFD represents one of the most widely used HPC applications in aerospace, automotive and other engineering areas such as turbine-design. For server hardware, we leverage the ThunderX platform from Cavium,... » read more

Pushing DRAM’s Limits

By Kevin Fogarty - 14 Dec, 2017 - Comments: 1

If humans ever do create a genuinely self-aware artificial intelligence, it may well exhibit the frustration of waiting for data arrive. The access bandwidth of DRAM-based computer memory has improved by a factor of 20x over the past two decades. Capacity increased 128x during the same period. But latency improved only 1.3x, according to Kevin Chang, a researcher at Carnegie Mellon Universit... » read more

Tech Talk: 802.11ax Multi-User

By Ed Sperling - 12 Dec, 2017 - Comments: 0

Daniel Webb, staff marketing manager at Marvell, talks about the new wireless standard, what's needed to make it work, and why it's so critical in the home and office. https://youtu.be/xIG7J928XFs » read more

Advanced Packaging Is Suddenly Very Cool

By Ed Sperling - 11 Dec, 2017 - Comments: 2

The hottest chip markets today—automotive AI for autonomous and heavily assisted driving, machine learning, virtual and augmented reality—all are beginning to look at advanced packaging as the best path forward for improving performance and reducing power. Over the past four years, which is when 2.5D and fan-out wafer-level packaging first really began garnering interest, these and othe... » read more

Hyperscaling The Data Center

By Kevin Fogarty - 07 Dec, 2017 - Comments: 1

Enterprise data centers increasingly will look and behave more like slimmed-down versions of hyperscale data centers as chipmakers and other suppliers adapt systems developed for their biggest customers to in-house IT faciilities. The new chips and infrastructure that will serve as building blocks in these facilities will be more power-efficient, make better use of space and generate less he... » read more

A Better Way To Connect The Home

By Sree Durbha - 07 Dec, 2017 - Comments: 0

The concept of a fully ‘connected home’ has been discussed for more than 20 years. However, widespread proliferation has taken far longer than anyone could have originally imagined. For a long time, deployment activity seemed to be limited to a relatively small number of high value installations. These installations were generally complicated to implement and their operation was not very us... » read more

The Week in Review: IoT

By Jeff Dorsch - 22 Nov, 2017 - Comments: 0

Commentary Chris Voce of Forrester Research writes that the Internet of Things next year will move beyond experimentation in this piece. “At Forrester we believe IoT extends beyond devices and connectivity,” he writes. “But it's the business impact of IoT that truly defines what it is: the insights that you can derive with analytics and the business outcomes you can achieve.” M&A M... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Marvell