tag: MaxLinear

Characterization, Modeling, And Model Parameter Extraction Of 5nm FinFETs
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A technical paper titled “A Comprehensive RF Characterization and Modeling Methodology for the 5nm Technology Node FinFETs” was published by researchers at IIT Kanpur, MaxLinear Inc., and University of California Berkeley. Abstract: "This paper aims to provide insights into the thermal, analog, and RF attributes, as well as a novel modeling methodology, for the FinFET at the industry stan... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Oct, 2022 - Comments: 0

Cadence unveiled a new environment to automate and accelerate the complete design closure cycle from signoff optimization through routing, static timing analysis (STA), and extraction. The Certus Closure Solution allows concurrent, full-chip optimization through a massively parallel and distributed architecture and engine shared with Cadence’s Innovus Implementation System and the Tempus Timi... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 06 May, 2022 - Comments: 0

Acquisitions & Investments California-based MaxLinear plans to acquire Taiwan-based Silicon Motion (SMI), in a cash and stock deal valued at about $3.8 billion. Silicon Motion’s NAND flash controller technology for solid state storage devices, will extend MaxLinear’s RF, analog, and mixed signal portfolio. ISMC will invest about $3 billion in a semiconductor plant in India’s south... » read more

Week In Review: Design, Low Power
By Jesse Allen - 06 May, 2022 - Comments: 0

Rambus will acquire Hardent, a provider of design services and IP. Rambus said Hardent's silicon design, verification, compression, and Error Correction Code (ECC) expertise will provide key resources for the Rambus CXL Memory Interconnect Initiative. “Driven by the demands of advanced workloads like AI/ML and the move to disaggregated data center architectures, industry momentum for CXL-base... » read more

Week In Review: Design, Low Power
By Jesse Allen - 25 Feb, 2022 - Comments: 0

Tools & IP Codasip debuted two new customizable low power embedded RISC-V processor cores. To support embedded AI applications, the L31/L11 cores run Google’s TensorFlowLite for Microcontrollers. Codasip Studio tools can be used to customize for specific system, software, and application requirements. Licensing the CodAL description of a Codasip RISC-V core grants customers a full archit... » read more

MaxLinear And Calibre RealTime Digital
By Siemens EDA - 26 May, 2021 - Comments: 0

MaxLinear implemented the Calibre RealTime Digital interface for fast, iterative, signoff DRC checking and fixing during floorplanning and placement. They not only reduce the total of batch DRC iterations, but also eliminate potential late-stage issues during final physical verification signoff that are exponentially harder to fix. Adopting the Calibre RealTime Digital interface enabled MaxLine... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Sep, 2020 - Comments: 0

Top story NVIDIA and SoftBank Group Corp. (SBG) have announced a definitive agreement under which NVIDIA will acquire Arm from SBG and the SoftBank Vision Fund in a transaction valued at $40 billion. Market research Here’s the latest fab equipment forecast from VLSI Research: “The semiconductor equipment market has been very resilient in 2020 despite a very challenging macroeconomic ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Apr, 2020 - Comments: 0

MaxLinear will acquire Intel's Home Gateway Platform Division. MaxLinear, a provider of RF, analog, and mixed-signal ICs, will buy the Home Gateway Platform Division for an all-cash, asset transaction valued at $150 million. The division comprises Wi-Fi Access Points, Ethernet and Home Gateway SoC products deployed across operator and retail markets. The deal is expected to close in the third q... » read more

Week In Review: Design, Low Power
By Jesse Allen - 14 Dec, 2018 - Comments: 0

The MIPI Alliance released MIPI I3C Basic v1.0, a subset of the MIPI I3C sensor interface specification that bundles 20 of the most commonly needed I3C features for developers and other standards organizations. The royalty-free specification includes backward compatibility with I2C, 12.5 MHz multi-drop bus that is over 12 times faster than I2C supports, in-band interrupts to allow slaves to not... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 29 Dec, 2017 - Comments: 0

Chipmakers Christopher Rolland, an analyst at Susquehanna International, expects to see more merger and acquisition activity in the IC industry heading into 2018. “M&A activity slowed in 2017, but the year is going out with a bang!” Rolland said in a recent research note. Towards the end of 2017, for example, Broadcom made a bid for Qualcomm, while Marvell announced intent to buy Cavium. ... » read more

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