tag: MediaTek

Confusion Grows Over Packaging And Scaling
By Ann Mutschler - 15 Oct, 2020 - Comments: 0

The push toward both multi-chip packaging and continued scaling of digital logic is creating confusion about how to classify designs, what design tools work best, and how to best improve productivity and meet design objectives. While the goals of design teams remains the same — better performance, lower power, lower cost — the choices often involve tradeoffs between design budgets and ho... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 02 Oct, 2020 - Comments: 0

Security Synopsys’ Cybersecurity Research Center disclosed that its research resulted in three Common Vulnerability and Exposures (CVE) advisories on wireless router chipsets that have partial authentication bypass vulnerabilities. The vulnerability lets an attacker send an unencrypted data frame through a WPA2-protected WLAN, which will may respond with an encrypted data frame that the atta... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Sep, 2020 - Comments: 0

AI on edge Cadence’s Tensilica Vision P6 DSP IP will be in Kneron’s KL720, a 1.4TOPS AI system-on-chip (SoC) targeted for AI of things (AIoT), smart home, smart surveillance, security, robotics and industrial control applications. Arm announced its Arm Cortex-R82, a 64-bit, Linux-capable Cortex-R processor for enterprise and computational storage systems. The processor is designed to pr... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 Mar, 2020 - Comments: 0

Silicon Labs will acquire Redpine Signals' Wi-Fi and Bluetooth business, development center in Hyderabad, India, and extensive patent portfolio for $308 million in cash. Silicon Labs says the acquisition will expand the company's IoT wireless technology, including smart phone and industrial IoT, and accelerate its roadmap for Wi-Fi 6. The deal is expected to close in the second quarter of 2020.... » read more

Big Design, IP and End Market Shifts In 2020
By Brian Bailey - 30 Jan, 2020 - Comments: 0

EDA is on a roll. Design starts are up significantly thanks to increased investment in areas such as AI, a plethora of new communications standards, buildout of the Cloud, the race toward autonomous driving and continued advancements in mobile phones. Many designs demand the latest technologies and push the limits of complexity. Low power is becoming more than just reducing wasted power at t... » read more

Week In Review: Design, Low Power
By Jesse Allen - 13 Dec, 2019 - Comments: 0

Rambus finalized its acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure, for $45 million at closing, and up to an additional $20 million, subject to certain revenue targets in 2020. RISC-V SiFive unveiled two new product families. The SiFive Apex processor cores target mission-critical processors with Size, Weight, and Power (SW... » read more

Week in Review: Iot, Security, Automotive
By Susan Rambo - 08 Nov, 2019 - Comments: 0

IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Oct, 2019 - Comments: 0

Chipmakers The semiconductor capital spending race continues to escalate in the leading-edge logic space. Intel and Samsung have separately announced big capital spending plans in 2019. Intel’s latest CapEx budget is $15.5 billion in 2019, while Samsung’s CapEx is slated for $16.204 billion for the year, according to KeyBanc Capital Markets. Now, TSMC is raising the stakes. TSMC this... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Aug, 2019 - Comments: 0

Chipmakers GlobalFoundries has filed suits in the U.S. and Germany, alleging that semiconductor manufacturing technologies used by TSMC infringe upon 16 of GF's patents. The suits were filed in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germ... » read more

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