tag: MediaTek

Week In Review, Manufacturing, Test
By Karen Heyman - 01 Jul, 2022 - Comments: 0

Samsung announced initial production of its 3nm process node, which uses a gate-all-around (nanosheet) transistor structure that the company calls Multi-Bridge-Channel FET (MBCFET). The first-generation 3nm process can reduce power consumption by up to 45% compared with a 5nm process, as well as improve performance by 23% and reduce area by 16%, according to the company. The second-generation 3... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 Jun, 2022 - Comments: 0

RISC-V RISC-V International announced four new specification and extension approvals. Efficient Trace for RISC-V defines an approach to processor tracing that uses a branch trace. RISC-V Supervisor Binary Interface architects a firmware layer between the hardware platform and the operating system kernel using an application binary interface in supervisor mode to enable common platform services... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 10 Jun, 2022 - Comments: 0

Automotive, mobility Lightyear, an automotive company based in the Netherlands, announced its solar car, the Lightyear 0, which goes into production this year. The car has a Worldwide Harmonised Light Vehicle Test Procedure (WLTP) range of 625 kilometers/388 miles and can charge itself while driving or parked, using double curved solar arrays on its roof. The daily charging adds 70 kilometers/... » read more

Week In Review: Design, Low Power
By Jesse Allen - 27 May, 2022 - Comments: 0

EnSilica listed on the London Stock Exchange's AIM market under the ticker ENSI. EnSilica designs mixed signal ASICs for system developers in the automotive, industrial, healthcare, and communications markets. It also has a portfolio of core IP covering cryptography, radar and communications systems. AIM is the LSE’s market for small and medium sized growth companies. "In connection with Admi... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 13 May, 2022 - Comments: 0

Automotive, mobility Fraunhofer IIS has opened a five-kilometer (3.11-mile) 5G test bed for automotive 5G applications near the city of Rosenheim in Bavaria, Germany. A closed 5G network with multiple base stations covers the test track, where connected cars can be tested under real conditions. “The automotive test bed is designed specially for developers and users that want to test new conn... » read more

Week In Review: Design, Low Power
By Jesse Allen - 18 Mar, 2022 - Comments: 0

Alphawave IP will acquire the OpenFive business unit from SiFive. The $210 million cash deal will bring OpenFive’s high-speed connectivity SoC IP portfolio to Alphawave and nearly double its IPs currently available, including an expanded die-to-die connectivity portfolio as well as adding data center and networking custom silicon solutions. "When we completed our IPO in 2021, we committed to ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Mar, 2022 - Comments: 0

Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Dec, 2021 - Comments: 0

Chipmakers TSMC has introduced another version of its 4nm process technology. The process, called N4X, is tailored for high-performance computing products. Recently, TSMC introduced another 4nm process, called N4P, which is an enhanced version of its 5nm technology. N4X is also an enhanced version of its 5nm technology. N4X, however, offers a performance boost of up to 15% over TSMC’s N5 pro... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Dec, 2021 - Comments: 0

Memory CEA-Leti demonstrated 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node. It utilizes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm² and solder reflow compatibility for the first time for this type of memory. The researchers anticipate it will be useful for embedded applications such at IoT and wearable dev... » read more

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