Generative AI Training With HBM3 Memory


One of the biggest, most talked about application drivers of hardware requirements today is the rise of Large Language Models (LLMs) and the generative AI which they make possible.  The most well-known example of generative AI right now is, of course, ChatGPT. ChatGPT’s large language model for GPT-3 utilizes 175 billion parameters. Fourth generation GPT-4 will reportedly boost the number of... » read more

Low Density Of LPDDR4x DRAM — The Best Choice For Edge AI


Edge AI computes the data as close as possible to the physical system. The advantage is that the processing of data does not require a connected network. The computation of data happens near the edge of a network, where the data is being developed, instead of in a centralized data-processing center. One of the biggest benefits of edge AI is the ability to secure real-time results for time-sensi... » read more

Changes In Memory Design


An explosion of data in automotive, cloud, and AI are altering the fundamentals of memory design. One size no longer fits all, as memory is used for a broader set of applications, from automotive and cloud to consumer devices. Anand Theruvengadam, director of product management at Synopsys, talks about the impact of big data applications on density, memory stacking, and growing concerns about r... » read more

Resistive Switching Memory Based on Thin-Film Design of Amorphous Hafnium Oxide (Cambridge & Others)


A technical paper titled “Thin-film design of amorphous hafnium oxide nanocomposites enabling strong interfacial resistive switching uniformity” was published by researchers at University of Cambridge, Linköping University, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo. Abstract: "A design concept of phase-separated amorphous nano... » read more

Improving DRAM Device Performance Through Saddle Fin Process Optimization


As DRAM technology nodes have scaled down, access transistor issues have been highlighted due to weak gate controllability. Saddle Fins with Buried Channel Array Transistors (BCAT) have subsequently been introduced to increase channel length, prevent short channel effects, and increase data retention times [1]. However, at technology nodes beyond 20nm, securing sufficient device performance (su... » read more

LPDDR5X: High Bandwidth, Power Efficient Performance For Mobile & Beyond


Looking back over recent history in the memory landscape, we can clearly see a trend of new applications growing sufficiently large enough to command the creation of new memory technologies tailored to their specific needs. We saw this with the creation of GDDR for graphics and later HBM for AI/ML applications. Low-Power Double Data Rate (LPDDR) emerged as a specialized memory designed for mobi... » read more

Journey From Cell-Aware To Device-Aware Testing Begins


Early results of using device-aware testing on alternative memories show expanded test coverage, but this is just the start. Once the semiconductor industry realized that it was suffering from device failures even when test programs achieved 100% fault coverage, it went about addressing this disconnect between the way defects manifest themselves inside devices and the commonly used fault mod... » read more

HBM3 And GDDR6: Memory Solutions For AI


AI/ML changes everything, impacting every industry and touching the lives of everyone. With AI training sets growing at a pace of 10X per year, memory bandwidth is a critical area of focus as we move into the next era of computing and enable this continued growth. AI training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM3 and GDDR6... » read more

Memory Disaggregation Research And Making It Practical With Hardware Trends (U. of Michigan)


A new technical paper titled "Memory Disaggregation: Advances and Open Challenges" was published by researchers at University of Michigan. Abstract "Compute and memory are tightly coupled within each server in traditional datacenters. Large-scale datacenter operators have identified this coupling as a root cause behind fleet-wide resource underutilization and increasing Total Cost of Owners... » read more

Week In Review: Semiconductor Manufacturing, Test


TECHCET is forecasting semiconductor precursor revenues, both for high-ƙ metal dielectrics and low-ƙ dielectrics, will increase in the second half of 2023, rebounding from the current zero percent growth rate. Wafer start volumes are expected to rebound in 2024 with expansions in 2nm and 3nm logic devices. SEMI also predicts the global slump in semiconductor sales will end this quarter, gi... » read more

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