tag: Mentor Graphics

Measuring Verification Productivity
By Ann Mutschler - 25 Jul, 2013 - Comments: 0

By Ann Steffora Mutschler In this era of mammoth SoCs that require the utmost in verification complexity, it’s not enough to have a methodology. Design and verification teams also need to measure their productivity to constantly stay ahead of the curve. The more sophisticated customers are measuring a lot of things, explained Steve Bailey, marketing director at Mentor Graphics, “and for... » read more

GPUs May Speed UP EDA Algorithms
By Ann Mutschler - 25 Jul, 2013 - Comments: 1

The sequential EDA algorithms of old cannot keep pace with increasing design complexity, which is driving the industry to look at parallelism and other computational architectures such as the graphical processing unit (GPU). A 10X or 20X speedup for gate-level simulations means that a test that runs today in a week will run in less than a day, and a test that runs today in a month will run i... » read more

Experts At The Table: Automotive Electronics
By Ann Mutschler - 25 Jul, 2013 - Comments: 0

By Ann Steffora Mutschler System-Level Design sat down to discuss the opportunities in automotive electronics with Alexandre Palus, principal SoC architect at Altera; Aveek Sarkar, VP of product engineering & support at Apache; Mladen Nizic, engineering director, mixed signal solution at Cadence; and Stephen Pateras, product marketing director, silicon test solutions at Mentor Graphics. Wh... » read more

Unifying Hardware-Assisted Verification And Validation Using UVM And Emulation
By Various Writers - 25 Jul, 2013 - Comments: 0

Successful approaches to improve verification productivity are to increase the speed of verification and begin validating software/hardware integration very early in the design process. Historically, verification and validation platforms have been developed as separate flows, preventing reuse of modules and methods between the two. As a consequence, various customized verification and validatio... » read more

Blog Review: July 24
By Ed Sperling - 24 Jul, 2013 - Comments: 0

By Ed Sperling Mentor’s Harry Foster unleashes part six of the Wilson Research Group functional verification study, this segment digging deeper into the time spent in verification. The numbers have surpassed time spent on the design side, which either means the front-end tools are getting better or the verification problem is becoming more difficult. Cadence’s Brian Fuller interviews I... » read more

Why Should A Decision Be Delayed?
By Jon McDonald - 22 Jul, 2013 - Comments: 0

By Jon McDonald Way back in college when I first learned about “delayed binding” I was absolutely ecstatic. In its most general interpretation this is not just a software concept. It’s a way of life. The important part of the concept is to understand that a decision or an action should not be taken until it needs to be taken. This is a relatively simple concept with very broad implica... » read more

The Week In Review: July 22
By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

The Week In Review: July 19
By Ed Sperling - 19 Jul, 2013 - Comments: 0

By Ed Sperling Synopsys rolled out a 28nm data converter IP portfolio for analog-to-digital and digital-to-analog converters, as well as integrated PLLs. Synopsys says the new architecture saves up to 76% of the power and 86% of area. Mentor Graphics added intelligent software-driven verification to its functional verification platform. New is the ability to automatically generate embedded ... » read more

EM Analysis At Advanced Nodes
By Valeriy Sukharev - 19 Jul, 2013 - Comments: 0

EM statistics Almost 50 years ago, James Black demonstrated experimentally that TTF of the metal line stressed by direct current (DC) of density j at the temperature T follows the dependency where k is the Boltzmann constant, and A is the proportionality coefficient, which can depend on line geometry, residual stress, and temperature. Two critical parameters, the current density exponen... » read more

A Tale Of Two Standards
By Ed Sperling - 18 Jul, 2013 - Comments: 0

By Ed Sperling It could well be one of the strangest developments in standards history. Two competing standards for power formats were rolled out in the middle of the last decade and aside from a few cries of foul they fell below the radar screen of most chip designers and architects for a half-dozen years. Fast forward to the present and the Common Power Format (CPF) and Unified Power Form... » read more

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