tag: Mentor

Week In Review: Design, Low Power
By Jesse Allen - 10 Dec, 2021 - Comments: 0

Intel intends to take Mobileye public in mid-2022 on a US market through an IPO of newly issued stock. The subsidiary, which Intel acquired in 2017, develops SoCs for ADAS and autonomous driving solutions. Mobileye has achieved record revenue year-over-year with 2021 gains expected to be more than 40 percent higher than 2020, highlighting the powerful benefits to both companies of our ongoing p... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Dec, 2021 - Comments: 0

Pervasive computing An outage in network equipment at the US-EAST-1 Region of Amazon Web Services this week reminded customers of the downside to having every appliance run via a data center. Users accessing apps tied to AWS on the East coast found services did not work, including Alexa, Ring, smart appliances, some Amazon warehouses and packaging delivery, web APIs such as Slack, and some str... » read more

Amdahl Limits On AI
By Brian Bailey - 09 Dec, 2021 - Comments: 0

Software and hardware both place limits on how fast an application can run, but finding and eliminating the limitations is becoming more important in this age of multicore heterogeneous processing. The problem is certainly not new. Gene Amdahl (1922-2015) recognized the issue and published a paper about it in 1967. It provided the theoretical speedup for a defined task that could be expected... » read more

Innovations In Sensor Technology
By John Koon - 09 Dec, 2021 - Comments: 0

Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

Shifting Left In P&R With In-Design Signoff Fill For Faster And More Accurate Tapeouts
By Srinivas Velivala - 09 Dec, 2021 - Comments: 0

Place and route (P&R) engineers are always on the lookout for ways to optimize their design flows to ensure designs meet their design power, performance, and area (PPA) goals while also hitting tapeout deadlines. The introduction of the Calibre RealTime Digital interface made Calibre nmDRC and Calibre nmDRC Recon design rule checking (DRC) verification available during the P&R process t... » read more

Veloce Prototyping Solutions Accelerate Verification Of HPC AI-Enabled SoCs
By Siemens EDA - 08 Dec, 2021 - Comments: 0

This white paper goes through the journey of understanding how to meet quality requirements and accelerate time-to-market for your company’s latest flagship high performance computing (HPC) artificial intelligence (AI)-enabled system-on-chip (SoC) design. The starting point in the journey explores the use cases for designs illustrating the impact HPC AI-enabled systems and resources have on o... » read more

Big Changes Ahead For Inside Auto Cabins
By Bryon Moyer - 08 Dec, 2021 - Comments: 0

The space we occupy inside our vehicles is poised to change from mere enclosure to participant in the driving experience. Whether for safety or for comfort, a wide range of sensors are likely to appear that will monitor the “contents” of the vehicle. The overall approach is referred to as an in-cabin monitoring system (ICMS), but the specific applications vary widely. “In-cabin sensing... » read more

Blog Review: Dec. 8
By Jesse Allen - 08 Dec, 2021 - Comments: 0

Arm's Shidhartha Das introduces a method to achieve fast yet accurate power modelling for both design and runtime power introspection within the same unified framework using machine learning and data science approaches. Synopsys' Mike Borza warns that the semiconductor industry is facing a flood of counterfeit chips and why being aware of different types of semiconductor scams and tackling t... » read more

Using Manufacturing Data To Boost Reliability
By Ed Sperling and Ann Mutschler - 07 Dec, 2021 - Comments: 0

As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

Speeding Up Scan-Based Volume Diagnosis
By Bryon Moyer - 07 Dec, 2021 - Comments: 0

In the critical process known as new-product bring-up, it’s a race to get new products to yield as quickly as possible. But the interplay between increasingly complex aspects of designs and process makes it difficult to find root causes of yield issues so they can be fixed quickly. Advanced processes have very high defectivity, and learning must be fast and effective. While progress has be... » read more

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