Edge Devices Require New Security Approaches


The diversity of connected devices and chips at the edge — the vaguely defined middle ground between the end point and the cloud — is significantly widening the potential attack surface and creating more opportunities for cyberattacks. The edge build-out has been underway for at least the past half-decade, largely driven by an explosion in data and increasing demands to process that data... » read more

Ready For Curvilinear: New Innovations For Resistance Extraction


The rapid evolution of semiconductor industry, fueled by the propagation of IOT applications, image sensors, photonics and MEMS applications and other emerging technologies dramatically increased the complexity of IC design. Designers often use unconventional structures to achieve the desired functionality and optimal performance. For example, image sensors use wide polygons in the layout and a... » read more

Developing Workflows To Streamline System-Level Design


Experts At The Table: One of the big challenges facing EDA companies is explaining to customers what's possible, how to streamline their designs, and what can be accomplished at what level of risk. Semiconductor Engineering sat down to talk about how relationships are fundamentally changing between EDA companies and their customers Michal Siwinski, chief marketing officer at Arteris; Chris Muet... » read more

Blog Review: Aug. 28


Synopsys' Jon Ames checks out how the Ultra Ethernet Consortium aims to revolutionize networking by optimizing Ethernet for the rapidly evolving AI and HPC workloads by addressing critical issues like tail latency that are encountered by machine learning algorithms in large compute clusters. Cadence's Kos Gitchev introduces the DDR5 Multiplexed Rank DIMM (MRDIMM), a memory module technology ... » read more

Chip Industry Week In Review


Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Hardware Security Set To Grow Quickly


Experts At The Table: The hardware security ecosystem is young and relatively small but could see a major boom in the coming years. As companies begin to acknowledge how vulnerable their hardware is, industry standards are being set, but must leave room for engineers to experiment. As part of an effort to determine the best way forward, Semiconductor Engineering sat down with a panel of experts... » read more

Blog Review: Aug. 21


Cadence's Reela Samuel explores the critical role of PCIe 6.0 equalization in maintaining signal integrity and solutions to mitigate verification challenges, such as creating checkers to verify all symbols of TS0, ensuring the correct functioning of scrambling, and monitoring phase and LTSSM state transitions. Siemens' John McMillan introduces an advanced packaging flow for Intel's Embedded ... » read more

Blog Review: Aug. 14


Cadence's Dimitry Pavlovsky highlights two new features in the AMBA CHI protocol Issue G update that enhance security of the Arm architecture: Memory Encryption Contexts, which allows data in each Realm in the memory to be encrypted with a different encryption key, and Device Assignment, which introduces hardware provisions to support fully coherent caches in partially trusted remote coherent d... » read more

Fantastical Creatures


In my day job I work in the High-Level Synthesis group at Siemens EDA, specifically focusing on algorithm acceleration. But on the weekends, sometimes, I take on the role of amateur cryptozoologist. As many of you know, the main Siemens EDA campus sits in the shadow of Mt. Hood and the Cascade Mountain range. This is prime habitat for Sasquatch, also known as “Bigfoot”. This weekend, ar... » read more

Chip Industry Week In Review


Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

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