Todd Burkholder

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Todd Burkholder is a senior editor at Siemens DISW. For over 25 years, he has worked as editor, author, and ghost writer with internal and external customers to create print and digital content across a broad range of EDA technologies. Burkholder began his career in marketing for high-technology and other industries in 1992 after earning a Bachelor of Science at Portland State University and a Master of Science degree from the University of Arizona.

Author's Latest Posts

Opening The Door To STCO: Hierarchical Device Planning

By Todd Burkholder - 29 Jan, 2026 - Comments: 0

By Todd Burkholder and Per Viklund The heterogeneous integration of multiple chiplets in a single packaging platform is critical for many high-performance market segments, such as AI, hyperscalers, high-performance computing, cloud data centers, neural processors, and even autonomous vehicles. This increased design complexity has led to an explosion in device complexity and pin counts. It... » read more

Simplifying HW/SW Co-Verification With PSS Led UVM And C Tests

By Todd Burkholder - 27 Feb, 2025 - Comments: 0

By Todd Burkholder, Wael Abdelaziz Mahmoud, Tom Fitzpatrick, Vishal Baskar, and Mohamed Nafea The complexity of system on chips (SoCs) continues to grow rapidly with the integration of more functionality onto a single chip. As a result, traditional verification methodologies struggle to keep pace with the growing complexities, leading to longer development cycles and increased risk of design... » read more