tag: Mentor

Blog Review: December 13
By Jesse Allen - 13 Dec, 2023 - Comments: 0

Synopsys' Charles Dittmer discusses key and emerging use cases for Bluetooth Low Energy and how combining BLE with other wireless protocols can open new avenues of functionality for application areas including automotive, hearables, and retail. Cadence's Neelabh Singh points out changes in the terminologies describing USB4 links and shows the various possible link configurations put forth by... » read more

The Uncertain Future Of In-Memory Compute
By Karen Heyman - 13 Dec, 2023 - Comments: 0

Experts at the Table — Part 2: Semiconductor Engineering sat down to talk about AI and the latest issues in SRAM with Tony Chan Carusone, chief technology officer at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be found here and part 3 is h... » read more

Chip Industry Week In Review
By The SE Staff - 08 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Security Becoming Core Part Of Chip Design — Finally
By Ann Mutschler - 07 Dec, 2023 - Comments: 1

Security is shifting both left and right in the design flow as chipmakers wrestle with how to build devices that are both secure by design and resilient enough to remain secure throughout their lifetimes. As increasingly complex devices are connected to the internet and to each other, IP vendors, chipmakers, and systems companies are racing to address existing and potential threats across a ... » read more

Auto Network Speeds Rise As Carmakers Prep For Autonomy
By John Koon - 07 Dec, 2023 - Comments: 0

In-vehicle networks are starting to migrate from domain architectures to zonal architectures, an approach that will simplify and speed up communication in a vehicle using fewer protocols, less wiring, and ultimately lower cost. Zonal architectures will partition vehicles into zones that are more manageable and flexible, but getting there will take time. There is so much legacy technology in ... » read more

AI Races To The Edge
By Karen Heyman - 07 Dec, 2023 - Comments: 0

AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

Use Advanced DFT And Silicon Bring Up To Accelerate AI Chip Design
By Siemens EDA - 07 Dec, 2023 - Comments: 0

The market for AI chips is growing quickly, with the 2022 revenue of $20B expected to grow to over $300B by 2030. To keep up with the demand and stay competitive, AI chip designers set aggressive time-to-market goals. Design teams looking for ways to shave significant time off chip development time can look to advanced DFT and silicon bring up techniques described in this paper, including hiera... » read more

Blog Review: Dec. 6
By Jesse Allen - 06 Dec, 2023 - Comments: 0

Cadence's Vinod Khera checks out potential implications of generative AI for EDA, including how it could increase the learning rate of students and reduce the rising verification cost. Synopsys' Kiran Vittal considers the driving factors behind RISC-V's growth and why it is becoming increasingly important for applications ranging from automotive to 5G mobile, AI, and data centers. Siemens... » read more

AI Accelerator Architectures Poised For Big Changes
By Ann Mutschler - 04 Dec, 2023 - Comments: 5

AI is driving a frenzy of activity in the chip world as companies across the semiconductor ecosystem race to include AI in their product lineup. The challenge now is how to make AI run faster, use less energy, and to be able to leverage it from the edge to the data center — particularly with the rollout of large language models. On the hardware side, there are two main approaches for accel... » read more

Chip Industry Week In Review
By The SE Staff - 01 Dec, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

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