tag: Mentor

Navigating Design Challenges
By Siemens EDA - 28 Mar, 2024 - Comments: 0

Explore the future of IC design with the Calibre Shift left initiative. In this paper, author David Abercrombie reveals how Siemens is changing the game for block/chip design-stage verification by moving Calibre verification and reliability analysis solutions further left in the design flow, including directly inside your P&R tool cockpit. Discover how you can reduce traditional long-loop v... » read more

V2X Security Is Multi-faceted, And Not All There
By Ann Mutschler - 27 Mar, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss Vehicle-To-Everything (V2X) technology and potential security issues, with Shawn Carpenter, program director, 5G and space at Ansys; Lang Lin, principal product manager at Ansys; Daniel Dalpiaz, senior manager product marketing, Americas, green industrial power division at Infineon; David Fritz, vice president of virtual and hy... » read more

Blog Review: Mar. 27
By Jesse Allen - 27 Mar, 2024 - Comments: 0

Cadence's Steve Brown suggests that multi-die technologies will be a key part of the path toward a faster, more efficient chip ecosystem that can support the compressed development cycles now emerging in the automotive industry. Synopsys' John Swanson, Madhumita Sanyal, and Priyank Shukla point to the role of simulation in ensuring seamless operation in the Ethernet ecosystem though rigorous... » read more

Digital Twins Target IC Tool And Fab Efficiency
By Laura Peters - 21 Mar, 2024 - Comments: 0

Digital twins have emerged as the hot "new" semiconductor manufacturing technology, enabling fabs to create a virtual representation of a physical system on which to experiment and optimize what's going on inside the real fab. While digital twin technology has been in use for some time in other industries, its use has been limited in semiconductor manufacturing. What's changing is the breadt... » read more

3D-IC Intensifies Demand For Multi-Physics Simulation
By Ann Mutschler - 20 Mar, 2024 - Comments: 0

The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design flow, expand and alter job responsibilities, and bring together the analog and digital design worlds in unprecedented ways. 3D-ICs will be the highest-performance advanced packaging option, in s... » read more

Blog Review: March 20
By Jesse Allen - 20 Mar, 2024 - Comments: 0

Synopsys' Kiran Vittal delves into AI chips, including the expansion of chip design beyond traditional semiconductor companies, adoption of RISC-V, and the use of formal equivalence checking to verify complex AI datapaths. Siemens' Patrick McGoff points to a survey that suggests projects deploying design for manufacturing within a PCB design flow are more likely to be completed on-time, on-q... » read more

Optimizing Energy At The System Level
By Brian Bailey - 18 Mar, 2024 - Comments: 0

Power is a ubiquitous concern, and it is impossible to optimize a system's energy consumption without considering the system as a whole. Tremendous strides have been made in the optimization of a hardware implementation, but that is no longer enough. The complete system must be optimized. There are far reaching implications to this, some of which are driving the path toward domain-specific c... » read more

Chip Industry Week In Review
By The SE Staff - 15 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

The City In The Tower: 3D ICs Transform The Electronics System Landscape
By Keith Felton - 14 Mar, 2024 - Comments: 0

By Keith Felton and Todd Burkholder The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect a watershed in the nature of electronics products that can be designed and manufactured. Yet again—as with personal computers, the internet, and smart phones—our increasingly digital world will never be the same. 3D IC architectures... » read more

The Rising Price Of Power In Chips
By Ed Sperling - 14 Mar, 2024 - Comments: 0

Power is everything when it comes to processing and storing data, and much of it isn't good. Power-related issues, particularly heat, dominate chip and system designs today, and those issues are widening and multiplying. Transistor density has reached a point where these tiny digital switches are generating more heat than can be removed through traditional means. That may sound manageable e... » read more

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