Power Integrity Analysis For High-Performance FPGAs


Efinix high-performance Titanium field-programmable gate arrays (FPGAs) are custom-tailored for the computing demands of mainstream applications, targeting markets from intelligent edge devices to industrial automation to vision systems to edge servers and communications (figure 1). Efinix customers use the Titanium line of FPGAs to ensure their complex, high-performance designs minimize power ... » read more

Efinix Implements Effective EM/IR Analysis For Leading-Edge FPGA Designs With The MPower Platform


Efinix turned to the Siemens mPower power integrity analysis platform to obtain the capabilities they needed for fast, accurate, full-chip EM/IR analysis of their Titanium FPGA designs. With no artificially enforced digital methodology, and a flat transistor analysis without elaborate views or modeling, the mPower platform analyzes custom layout and P&R IP in a single, seamless run. The mPo... » read more

Blog Review: Jan. 11


Cadence's Veena Parthan explains why in CFD, understanding the consequences of choices regarding the computational mesh is essential for generating high-fidelity simulation results. Synopsys' Chris Clark shares key considerations and questions to factor in when developing solutions for software-defined vehicles that must meet safety, security, reliability, and quality standards. Siemens E... » read more

Screening For Silent Data Errors


Engineers are beginning to understand the causes of silent data errors (SDEs) and the data center failures they cause, both of which can be reduced by increasing test coverage and boosting inspection on critical layers. Silent data errors are so named because if engineers don’t look for them, then they don’t know they exist. Unlike other kinds of faulty behaviors, these errors also can c... » read more

Shifting Toward Software-Defined Vehicles


Apple reportedly is developing a software-defined vehicle. But so are Renault, Hyundai, General Motors, and just about everyone else. Some of the benefits of SDVs include increased comfort, convenience, safety, reliability, and remote software and firmware updates. Preventive and predictive maintenance, and remote diagnostics, can be done more conveniently over the air, while vehicle behavio... » read more

Competing V2V Technologies Emerge, Create Confusion


The battle over vehicle-to-vehicle communications technology has begun, as governments step back to see which of two main competing standards and lots of related technology are best suited for reducing accidents. V2V is an often-discussed wireless communication protocol that enables vehicles to communicate with each other, easing traffic congestion, avoiding accidents, and ultimately improvi... » read more

High-Quality Test And Embedded Analytics For Secure Applications


Designs for secure applications such as smart cards and those used in the defense industry require security to ensure sensitive data is inaccessible to outside agents. This used to be a somewhat niche requirement and the implementation of custom solutions to meet these specific requirements was common. However, with the explosion within the semiconductor industry of automotive and cyber-phys... » read more

Navigating The Intersection Of Safety And Security


Automotive IC safety and security continue to be hot topics across the industry, and one phrase you may often hear during discussion is: An automotive IC can be secure without needing to be safe, but an automotive IC cannot be safe without also being secure. Adding a bit of detail to that: An automotive IC which has an incomplete security architecture provides potential attack vectors w... » read more

Blog Review: Jan. 4


Siemens EDA's Harry Foster investigates the percentage of total IC/ASIC project time spent in verification and increasing engineering headcount, particularly growing demand for verification engineers. Synopsys' Stelios Diamantidis argues that retargeting older chips using AI offers a way to move chip designs between nodes and absorb the market’s excess capacity. Cadence's Paul McLellan ... » read more

Comprehensive S-Parameter Verification Coverage With Analog FastSPICE


IC design is transforming at an accelerated pace along with fabrication technology. The need to incorporate more functionality has led to denser dies, multi-die chips, stacked 3D ICs and advanced packaging. Furthermore, design technology continues to progress towards supporting higher data rates to address the increasing demand for more and enhanced connectivity. We now must deal with much more... » read more

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