Week In Review: Design, Low Power

By Marie C. Baca - 23 Sep, 2022 - Comments: 0

Quantum The $3 million Breakthrough Prize in Fundamental Physics was awarded to four pioneers in the field of quantum information. The laureates are Charles H. Bennett, Gilles Brassard, David Deutsch and Peter Shor. Bennett and Brassard were part of the team that proved the usefulness of entanglement, while Deutsch defined the quantum version of a Turing machine. Shor invented the first "clear... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 23 Sep, 2022 - Comments: 0

Automotive, mobility Siemens Digital Industries Software and climate-tech company sustamize devised a way to add carbon emissions data to Siemens Xcelerator. Siemens created its Teamcenter Carbon Footprint Calculator software to help teams measure, simulate, reduce, and track their product carbon footprint early in the development phase. The calculator uses sustamize’s Product Footprint Engi... » read more

Why Every Design IP Needs A Complete QA Methodology

By WeiLii Tan - 22 Sep, 2022 - Comments: 0

Design IP is a key contributor to innovation in the semiconductor industry today. As the complexity and scale of silicon designs increase, so does design and verification time. Design IP enables modularization and re-use of design components, so that designers can leverage already-existing components as a baseline to accelerate design schedules. Therefore, it is not surprising that the usage of... » read more

Strengthening The Global Semi Supply Chain

By Ann Mutschler - 22 Sep, 2022 - Comments: 0

Within the semiconductor ecosystem, there are a number of dynamics pointing to the need for new ways of partnering in more meaningful ways that bring resiliency to the global semiconductor supply chain. One of these is the move to bespoke silicon, stemming from a shift in the companies that create most SoCs today -- the hyperscalar cloud providers. These market leaders know their workloads so w... » read more

Interactive Symmetry Checking Provides Faster, Easier Symmetry Verification For Analog And Custom IC Designs

By Siemens EDA - 22 Sep, 2022 - Comments: 0

Device symmetry ensures accurate, efficient performance of analog and custom IC designs. However, traditional physical verification for symmetry is complex and time-consuming. Calibre interactive symmetry checking runs inside the design environment to simplify and enhance IC symmetry verification. Design teams can use Calibre interactive symmetry checking to quickly and accurately analyze layou... » read more

How Memory Design Optimizes System Performance

By John Koon - 21 Sep, 2022 - Comments: 0

Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on the memory side. While the underlying technology still looks very familiar, the real shift is in the way those memories are connected to processing elements and various components within a syste... » read more

Blog Review: Sept. 21

By Jesse Allen - 21 Sep, 2022 - Comments: 0

Arm's Neil Burgess and Sangwon Ha explain why they've joined Intel and Nvidia in proposing a new 8-bit floating point specification to enable neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the vast amounts of model data between formats while reducing task loss to a minimum. Synopsys' Manuel Mota examines ver... » read more

Why Geofencing Will Enable L5

By Marie C. Baca - 19 Sep, 2022 - Comments: 1

What will it take for a car to be able to drive itself anywhere a human can? Ask autonomous vehicle experts this question and the answer invariably includes a discussion of geofencing. In the broadest sense, geofencing is simply a virtual boundary around a physical area. In the world of self-driving cars, it describes a crucial subset of the operational design domain — the geographic regio... » read more

Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 16 Sep, 2022 - Comments: 0

Automotive and mobility U.S. President Joe Biden announced the approval of $900 million in funding for a nationwide network of electrical vehicle charging stations in 35 states. The money is part of a multi-year, $7.5 billion plan to create 500,000 charging stations along federal highways. Industry executives told Reuters that remote human supervisors may be a permanent fixture of highly au... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO

By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

tag: Mentor

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Why Every Design IP Needs A Complete QA Methodology

Strengthening The Global Semi Supply Chain

Interactive Symmetry Checking Provides Faster, Easier Symmetry Verification For Analog And Custom IC Designs

How Memory Design Optimizes System Performance

Blog Review: Sept. 21

Why Geofencing Will Enable L5

Week In Review: Auto, Security, Pervasive Computing

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO