tag: Mentor

Is Standardization Required For Security?
By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2022 - Comments: 0

Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Using ML Methods In Production-Ready Engineering Solutions For IC Verification
By WeiLii Tan - 02 Aug, 2022 - Comments: 0

By WeiLii Tan & Jeff Dyck Semiconductor designs continue to push the envelope of performance, functionality, and efficiency while their application scope expands in high-performance computing, automotive solutions, and IoT devices. The increased design complexity, scale, and mission-critical operations of semiconductor designs mean that IC verification strategies must evolve to cover expon... » read more

2.5/3D IC Reliability Verification Has Come A Long Way
By Dina Medhat - 01 Aug, 2022 - Comments: 0

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a passive silicon interposer. The interposer is placed on a ball grid array (BGA) organic substrate. Micro-bumps attach each die to the interposer, and flip-chip (C4) bumps attach the interposer to the ... » read more

Scaling, Advanced Packaging, Or Both
By Ed Sperling - 01 Aug, 2022 - Comments: 0

Chipmakers are facing a growing number of challenges and tradeoffs at the leading edge, where the cost of process shrinks is already exorbitant and rising. While it's theoretically possible to scale digital logic to 10 angstroms (1nm) and below, the likelihood of a planar SoC being developed at that nodes appears increasingly unlikely. This is hardly shocking in an industry that has heard pr... » read more

Bespoke Silicon Redefines Custom ASICs
By Ann Mutschler - 28 Jul, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss bespoke silicon and what's driving that customization with Kam Kittrell, vice president of product management in the Digital & Signoff group at Cadence; Rupert Baines, chief marketing officer at Codasip; Kevin McDermott, vice president of marketing at Imperas; Mo Faisal, CEO of Movellus; Ankur Gupta, vice president and general manager of Siemens... » read more

Blog Review: July 27
By Jesse Allen - 27 Jul, 2022 - Comments: 0

Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 22 Jul, 2022 - Comments: 0

Ramping capacity Samsung is considering building as many as 11 fabs in central Texas, investing an estimated $200 billion and creating as many as 10,000 jobs. The plans came to light when the company filed paperwork for tax breaks. Samsung already has broken ground on a new $17 billion fab in Taylor, Texas. The remaining nine fabs, including two in nearby Austin, would be built over the next c... » read more

Week in Review: Design, Low Power
By Marie C. Baca - 22 Jul, 2022 - Comments: 0

Acquisitions Renesas completed its acquisition of Reality Analytics, which specializes in embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial and commercial products. Siemens Digital Industries Software will acquire Zona Technology, which develops aerospace simulation software. Siemens plans to integrate that software into its wXcelerator and Simcenter... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 22 Jul, 2022 - Comments: 0

Security Flex Logix Technologies is partnering with Intrinsic ID to secure and protect any device using its eFPGA, so the device can’t be modified maliciously, through physical attacks or remote hacking. Flex Logix’s EFLX ePFGA will have Intrinsic ID’s SRAM physical unclonable function (PUF), a military-grade security IP that gives a device a unique silicon ID. The ID secures confidentia... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy