tag: Mentor

High-Quality Test And Embedded Analytics Are Vital For Secure SoCs
By Lee Harrison - 11 Jan, 2022 - Comments: 0

Applications like as smart cards and devices used in the defense industry require security to ensure that sensitive data is inaccessible to outside agents. This used to be a niche requirement met through custom solutions. However, now that automotive and cyber-physical systems are proliferating, the requirements around secure test and monitoring are becoming mainstream. The current best strateg... » read more

Automotive Outlook: 2022
By Ann Mutschler - 06 Jan, 2022 - Comments: 0

The auto industry is widening its focus this year, migrating to new architectures that embrace better security, faster data movement, and eventually more manageable costs. The auto industry is facing both short-term and long-term challenges. In the short term, the chip shortage continues to top the list of concerns for the world's automakers. That shortage has delayed new vehicle deliveries,... » read more

Making PUFs Even More Secure
By Bryon Moyer - 06 Jan, 2022 - Comments: 0

As security has become a must-have in most systems, hardware roots of trust (HRoTs) have started appearing in many chips. Critical to an HRoT is the ability to authenticate and to create keys – ideally from a reliable source that is unviewable and immutable. “We see hardware roots of trust deployed in two use models — providing a foundation to securely start a system, and enabling a se... » read more

Managing Today’s Advanced Vehicle Networks Design Challenges
By Brendan Morris - 06 Jan, 2022 - Comments: 0

Today’s automotive electrical and electronic (E/E) architectures are highly complex, with the functionality of many vehicle features distributed across multiple discrete ECUs. The ECUs, sensors and actuators are not all directly connected, and much of the data communication occurs across networks, often through gateways over several networks. Modern E/E architectures are formally organized ar... » read more

High-Quality Test And Embedded Analytics For Secure Applications
By Siemens EDA - 05 Jan, 2022 - Comments: 0

Designs for secure applications such as smart cards and those used in the defense industry require security to ensure sensitive data is inaccessible to outside agents. This used to be a somewhat niche requirement and the implementation of custom solutions to meet these specific requirements was common. However, with the explosion within the semiconductor industry of automotive and cyber-phys... » read more

Blog Review: Jan. 5
By Jesse Allen - 05 Jan, 2022 - Comments: 0

Cadence's Paul McLellan listens in on the challenges Tesla sees in manufacturing batteries for electric vehicles at scale and the types of battery chemistries it are currently using. Synopsys' Mark Kahan finds out the launch steps involved with the James Webb Space Telescope and the role of optical design software in creating the new instruments for Near IR and Mid IR sensing. Siemens' An... » read more

Domain-Specific Design Drives EDA Changes
By Ann Mutschler - 03 Jan, 2022 - Comments: 0

The chip design ecosystem is beginning to pivot toward domain-specific architectures, setting off a scramble among tools vendors to simplify and optimize existing tools and methodologies. The move reflects a sharp slowdown in Moore's Law scaling as the best approach for improving performance and reducing power. In its place, chipmakers — which now includes systems companies — are pushing... » read more

Batteries Take Center Stage
By Heidi Elliott - 27 Dec, 2021 - Comments: 0

For any mobile electronic device, the biggest limiting factors are the size, age, type, and utilization of the batteries. Battery technology is improving on multiple fronts. The batteries themselves are becoming more efficient. They are storing more energy per unit of area, and work is underway to provide faster charging and to increase the percentage of that energy that can be used, as well... » read more

Reliability Concerns Shift Left Into Chip Design
By Ann Mutschler - 22 Dec, 2021 - Comments: 1

Demand for lower defect rates and higher yields is increasing, in part because chips are now being used for safety- and mission-critical applications, and in part because it's a way of offsetting rising design and manufacturing costs. What's changed is the new emphasis on solving these problems in the initial design. In the past, defectivity and yield were considered problems for the fab. Re... » read more

Challenges With Stacking Memory On Logic
By Ed Sperling - 22 Dec, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

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