Methodologies And Flows In A Rapidly Changing Market

By Ed Sperling - 29 Nov, 2018 - Comments: 0

A growing push toward more heterogeneity and customization in chip design is creating havoc across the global supply chain, which until a couple years ago was highly organized and extremely predictable. While existing tools still work well enough, no one has yet figured out the most efficient way to use them in a variety of new applications. Technology is still being developed in those marke... » read more

Re-using Common Simulation Set-Up Processes To Speed Regression

By Rohit Jain - 11 Oct, 2018 - Comments: 0

Functional verification of SoCs always has some kind of set up process. For complex SoCs, at least, this initial set up phase often consumes from 20 to 90% of each test’s total simulation time. And thousands of tests are run in the verification of a design. This set up phase could be either executing the exact same sequence of simulation steps, or programming the design to reach the same i... » read more

Overcoming Low Power Verification Challenges For Mixed-Signal SoC Designs

By Himanshu Bhatt - 11 Oct, 2018 - Comments: 0

With increasing SoC complexity and advanced power-aware architectures, a robust low power verification methodology is important for signing off the design at different stages from RTL through netlist. For mixed-signal SoCs, the challenge is, there is no well-defined low power methodology, nor are the industry’s low power verification tools equipped to handle custom designs. This article propo... » read more

The Coming Golden Age For Automotive E/E Design Services And Consulting

By Andrew Macleod - 03 May, 2018 - Comments: 0

By Andrew Macleod and Scott Majdecki The discipline of automotive E/E systems design is being transformed by trends like electrification and autonomous vehicles, which means there is a premium on methodologies like rapid platform (hardware/ software) prototyping, simulation and test, and electrical architecture optimization. Such methodologies hinge on advanced software design tools and the ... » read more

By the Power Vested in Me, I Now Pronounce You (The SoC Designer)…

By Dave Stratman - 08 Mar, 2018 - Comments: 0

…Doomed. Well, maybe that’s a little harsh, but your job won’t be getting any easier; that “happily ever after” may be harder to achieve than you think, and there are a number of reasons why. And by “me” (of vested power), here I’m really talking about the power of the consumer market as a whole and our collective insatiable demand for newer, shinier…well, just plain “coo... » read more

Smarter DFT Infrastructure And Automation Emerge As Keys To Managing DFT Design Scaling

By Ron Press - 21 Dec, 2017 - Comments: 0

By Ron Press and Vidya Neerkundar The reality of DFT for large and complex SoCs has introduced new risk into design schedules. DFT teams end up in the critical path to tape out while waiting for portions of the design to be complete, and there are more DFT integration steps than ever before. The traditional approaches to DFT work on huge designs pose problems of repeatability and reliability... » read more

Addressing Power Integrity Challenges For SoCs

By Synopsys - 11 Oct, 2017 - Comments: 0

Power integrity has become a crucial part of the system-on-a-chip (SoC) design flow because power-related issues can affect chip timing and even lead to complete device failure. Specifically, excessive rail voltage drop (IR-drop) and ground bounce can create timing problems and electromigration effects that impact a chip's performance and reliability. Analyzing a chip's power also poses diff... » read more

Design Convergence For 7nm Chips Needs Big Data-Driven Multi-Physics Optimization

By Scott Johnson - 08 Dec, 2016 - Comments: 0

Advancements in silicon process technologies are enabling companies to deliver products with faster performance, lower power and greater functionality. These benefits are especially attractive for chip manufacturers servicing markets such as high-end mobile and enterprise computing. However, the cost in terms of both dollars and resources associated with bringing 7-nanometer (nm) finFET-based s... » read more

Avoiding The Barriers For Multi-Board Systems Design Development

By Dave Wiens - 22 Nov, 2016 - Comments: 0

Designing electronic systems that comprise multiple interacting boards, connectors and cables requires a multi-discipline team collaboration to effectively manage design complexity for optimum product performance and reliability. Multi-board systems may comprise two boards or up to hundreds of boards, packing a cabinet or rack, with interconnected connectors and/or cables. Since the hardware fu... » read more

Who’s Profiting From Complexity

By Ed Sperling - 21 Dec, 2015 - Comments: 0

Tool vendors' profits increasingly are coming from segments that performed relatively poorly in the past, reflecting both a rise in complexity in designing chips and big improvements in the tools themselves. The impacts of power, memory congestion, advanced-node effects such as process variation, [getkc id="160" kc_name="electromigration"] and RC delay in [getkc id="36" kc_name="interconnect... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?