Week In Review: Design, Low Power

By Jesse Allen - 06 Nov, 2020 - Comments: 0

Tools Mentor unveiled Tessent Streaming Scan Network software for its Tessent TestKompress software. The new solution includes embedded infrastructure and automation that decouples core-level DFT requirements from the chip-level test delivery resources for a simplified bottom-up DFT flow. The bus-based scan data distribution architecture enables simultaneous testing of any number of cores and ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Nov, 2020 - Comments: 0

Automotive Bosch licensed Arteris IP’s FlexNoC interconnect products for Bosch’s automotive chips. “Arteris IP provides the easiest and fastest means to assemble the complex chips we require while allowing us to implement innovative functional safety mechanisms within our designs,” said Oliver Wolst, senior vice president integrated circuits at Bosch. Mentor, a Siemens business, int... » read more

AMD Wants An FPGA Company, Too

By Ed Sperling - 28 Oct, 2020 - Comments: 0

AMD signed a definitive agreement to acquire Xilinx for $35 billion in stock, setting the stage for a head-to-head battle against Intel in nearly all major markets. But there's more to this acquisition than just keeping up with AMD's arch-competitor. To begin with, the acquisition has a big impact on the programmable logic market. The only pure-play FPGA vendors left are Lattice, Achronix, a... » read more

Regaining The Edge In U.S. Chip Manufacturing

By Mark LaPedus & Ann Steffora Mutschler - 26 Oct, 2020 - Comments: 16

The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

What Happened To Execute-in-Place?

By Bryon Moyer - 25 Aug, 2020 - Comments: 0

Executing code directly from non-volatile memory, where it is stored, greatly simplifies compute architectures — especially for simple embedded devices like microcontrollers (MCUs). However, the divergence of memory and logic processes has made that nearly impossible today. The term “execute-in-place,” or ”XIP,” originated with the embedded NOR memory in MCUs that made XIP viable. ... » read more

Blog Review: July 22

By Jesse Allen - 22 Jul, 2020 - Comments: 0

In a video, Synopsys Chairman and co-CEO Aart de Geus discusses AI's computational wants, how 3DIC technology can infuse vitality into Moore’s Law and drive innovation for the semiconductor industry. Cadence's Paul McLellan looks back at the initial rise of digital cameras, the swift decline of the point-and-shoot as smartphones took over, and the development of increasingly complex CMOS i... » read more

ML Opening New Doors For FPGAs

By Bryon Moyer - 24 Jun, 2020 - Comments: 0

FPGAs have long been used in the early stages of any new digital technology, given their utility for prototyping and rapid evolution. But with machine learning, FPGAs are showing benefits beyond those of more conventional solutions. This opens up a hot new market for FPGAs, which traditionally have been hard to sustain in high-volume production due to pricing, and hard to use for battery-dri... » read more

Week In Review: Design, Low Power

By Jesse Allen - 22 May, 2020 - Comments: 0

Tools & IP Cadence unveiled ten two verification IP (VIP) to support hyperscale data centers, automotive, and consumer and mobile applications. The new VIPs include complete bus functional models, integrated protocol checks and coverage models, and a specification-compliant verification plan. The VIPs cover CXL, HBM3, Ethernet 802.3ck, CSI-2 3.0, MIPI I3C 1.1, TileLink, eUSB2, UFS 3.1, MIP... » read more

Memory Issues For AI Edge Chips

By Mark LaPedus - 23 Mar, 2020 - Comments: 3

Several companies are developing or ramping up AI chips for systems on the network edge, but vendors face a variety of challenges around process nodes and memory choices that can vary greatly from one application to the next. The network edge involves a class of products ranging from cars and drones to security cameras, smart speakers and even enterprise servers. All of these applications in... » read more

SiC Foundry Business Emerges

By Mark LaPedus - 23 Jan, 2020 - Comments: 1

Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the market will not be so easy for SiC foundry vendors and their customers. They are facing stiff competition from traditional SiC device vendors such as Cree, Infineon, Rohm and STMicroelectronics. ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Microchip

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

AMD Wants An FPGA Company, Too

Regaining The Edge In U.S. Chip Manufacturing

What Happened To Execute-in-Place?

Blog Review: July 22

ML Opening New Doors For FPGAs

Week In Review: Design, Low Power

Memory Issues For AI Edge Chips

SiC Foundry Business Emerges