Week In Review: Manufacturing, Test

By Mark LaPedus - 06 Nov, 2020 - Comments: 0

Chipmakers Earlier this year, the semiconductor industry saw little merger and acquisition activity. More recently, though, there has been a flurry of deals. In July, ADI moved to acquire Maxim. Then, Nvidia announced plans to acquire Arm for $40 billion, followed by AMD’s proposed move to buy Xilinx for $35 billion. Not to be outdone, Marvell has announced plans to buy Inphi. Companies a... » read more

Week In Review: Design, Low Power

By Jesse Allen - 06 Nov, 2020 - Comments: 0

Tools Mentor unveiled Tessent Streaming Scan Network software for its Tessent TestKompress software. The new solution includes embedded infrastructure and automation that decouples core-level DFT requirements from the chip-level test delivery resources for a simplified bottom-up DFT flow. The bus-based scan data distribution architecture enables simultaneous testing of any number of cores and ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 06 Nov, 2020 - Comments: 0

Automotive Bosch licensed Arteris IP’s FlexNoC interconnect products for Bosch’s automotive chips. “Arteris IP provides the easiest and fastest means to assemble the complex chips we require while allowing us to implement innovative functional safety mechanisms within our designs,” said Oliver Wolst, senior vice president integrated circuits at Bosch. Mentor, a Siemens business, int... » read more

AMD Wants An FPGA Company, Too

By Ed Sperling - 28 Oct, 2020 - Comments: 0

AMD signed a definitive agreement to acquire Xilinx for $35 billion in stock, setting the stage for a head-to-head battle against Intel in nearly all major markets. But there's more to this acquisition than just keeping up with AMD's arch-competitor. To begin with, the acquisition has a big impact on the programmable logic market. The only pure-play FPGA vendors left are Lattice, Achronix, a... » read more

Regaining The Edge In U.S. Chip Manufacturing

By Mark LaPedus & Ann Steffora Mutschler - 26 Oct, 2020 - Comments: 16

The United States is developing new strategies to prevent it from falling further behind Korea, Taiwan, and perhaps even China in semiconductor manufacturing, as trade tensions and national security concerns continue to grow. For years, the U.S. has been a leader in the development of new chip products like GPUs and microprocessors. But from a chip manufacturing standpoint, the U.S. is losin... » read more

What Happened To Execute-in-Place?

By Bryon Moyer - 25 Aug, 2020 - Comments: 0

Executing code directly from non-volatile memory, where it is stored, greatly simplifies compute architectures — especially for simple embedded devices like microcontrollers (MCUs). However, the divergence of memory and logic processes has made that nearly impossible today. The term “execute-in-place,” or ”XIP,” originated with the embedded NOR memory in MCUs that made XIP viable. ... » read more

Blog Review: July 22

By Jesse Allen - 22 Jul, 2020 - Comments: 0

In a video, Synopsys Chairman and co-CEO Aart de Geus discusses AI's computational wants, how 3DIC technology can infuse vitality into Moore’s Law and drive innovation for the semiconductor industry. Cadence's Paul McLellan looks back at the initial rise of digital cameras, the swift decline of the point-and-shoot as smartphones took over, and the development of increasingly complex CMOS i... » read more

ML Opening New Doors For FPGAs

By Bryon Moyer - 24 Jun, 2020 - Comments: 0

FPGAs have long been used in the early stages of any new digital technology, given their utility for prototyping and rapid evolution. But with machine learning, FPGAs are showing benefits beyond those of more conventional solutions. This opens up a hot new market for FPGAs, which traditionally have been hard to sustain in high-volume production due to pricing, and hard to use for battery-dri... » read more

Week In Review: Design, Low Power

By Jesse Allen - 22 May, 2020 - Comments: 0

Tools & IP Cadence unveiled ten two verification IP (VIP) to support hyperscale data centers, automotive, and consumer and mobile applications. The new VIPs include complete bus functional models, integrated protocol checks and coverage models, and a specification-compliant verification plan. The VIPs cover CXL, HBM3, Ethernet 802.3ck, CSI-2 3.0, MIPI I3C 1.1, TileLink, eUSB2, UFS 3.1, MIP... » read more

Memory Issues For AI Edge Chips

By Mark LaPedus - 23 Mar, 2020 - Comments: 3

Several companies are developing or ramping up AI chips for systems on the network edge, but vendors face a variety of challenges around process nodes and memory choices that can vary greatly from one application to the next. The network edge involves a class of products ranging from cars and drones to security cameras, smart speakers and even enterprise servers. All of these applications in... » read more

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tag: Microchip

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

AMD Wants An FPGA Company, Too

Regaining The Edge In U.S. Chip Manufacturing

What Happened To Execute-in-Place?

Blog Review: July 22

ML Opening New Doors For FPGAs

Week In Review: Design, Low Power

Memory Issues For AI Edge Chips

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