中文 English

Power, Performance — Avionics Designers Want It All


Not long ago, the prevailing philosophy among chip designers for aviation systems could be summed up as, “I feel the need — the need for speed.” Today, aviation’s top guns have pulled back on the throttle a bit. There’s a more nuanced discussion balancing the need for performance versus power, with other factors coming into consideration such as safety, security certifications and ove... » read more

Making Chip Packaging More Reliable


Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Digital Transformation In Aerospace And Defense Applications


Watching the aerospace and defense verticals, one of the most impactful publications in 2020 was probably Will Roper's "There Is No Spoon: The New Digital Acquisition Reality." Using visuals from "The Matrix", which at the time was called "the first movie of the 21st century," the Assistant Secretary of the Air Force for Acquisition, Technology, and Logistics painted a picture of a "simulation ... » read more

Design Issues For Chips Over Longer Lifetimes


Semiconductor Engineering sat down to discuss the myriad challenges associated with chips used in complex systems over longer periods of time them with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Frank Schirrmeister, senior group director for solution marketing at Cadence; Maurizio Griva, R&D Manager at Reply; and Laurent Maillet-Contoz, system and architec... » read more

The Good, Bad And Unknowns Of Flexible Devices


Flexible hybrid electronics are beginning to proliferate in consumer, medical, and industrial applications due to their comparatively low weight, thin profile, and the ability to literally bend the rules of design. Open any smart phone today and you're likely to find one or more of these flexible boards. Unlike standard printed circuit boards, FHE devices are printed using a combination of r... » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

All-in-One Vs. Point Tools For Security


Security remains an urgent concern for builders of any system that might tempt attackers, but designers find themselves faced with a bewildering array of security options. Some of those are point solutions for specific pieces of the security puzzle. Others bill themselves as all-in-one, where the whole puzzle filled in. Which approach is best depends on the resources you have available and y... » read more

Pivoting Toward Safety-Critical Verification In Cars


The inclusion of AI chips in automotive and increasingly in avionics has put a spotlight on advanced-node designs that can meet all of the ASIL-D requirements for temperature and stress. How should designers approach this task, particularly when these devices need to last longer than the applications? Semiconductor Engineering sat down to discuss these issues with Kurt Shuler, vice president of... » read more

Power-Hungry Safety And Security


There is a price to pay for everything. When it comes to adding safety and security into a device, the costs in terms of power and area can be significant, but if the task is taken seriously, those costs can be managed and minimized. New analysis and implementation tools are coming to market that can also help to keep the costs contained. But it also requires the right mindset. As more indus... » read more

Challenges In Printed And Disposable Chips


Printing inexpensive chips using technology developed for newspapers and magazines is gaining traction across a wide range of applications, from photovoltaic cells to sensors on a flexible substrate. But it's also adding a slew of new challenges that are unique to this approach. The world of flexible hybrid electronics (FHE) — printing integrated circuits on or attaching thin IC chips to a... » read more

← Older posts