tag: MIT

Discovering Orbital Multiferroicity in Pentalayer Rhombohedral Graphene (MIT)
By Technical Paper Link - 24 Oct, 2023 - Comments: 0

A technical paper titled “Orbital Multiferroicity in Pentalayer Rhombohedral Graphene” was published by researchers at Massachusetts Institute of Technology. Abstract (partial): "Ferroic orders describe spontaneous polarization of spin, charge, and lattice degrees of freedom in materials. Materials featuring multiple ferroic orders, known as multiferroics, play important roles in multi-fu... » read more

Chip Industry Week In Review
By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Chip Industry’s Technical Paper Roundup: October 17
By Liz Allan - 17 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=155 /] More Reading Technical Paper Library home » read more

Chip Industry Talent Shortage Drives Academic Partnerships
By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Fabless Approach To Embed Active Nanophotonics in Bulk CMOS By Co-Designing The BEOL Layers For Optical Functionality (MIT)
By Technical Paper Link - 11 Oct, 2023 - Comments: 0

A technical paper titled “Metal-Optic Nanophotonic Modulators in Standard CMOS Technology” was published by researchers at Massachusetts Institute of Technology. Abstract: "Integrating nanophotonics with electronics promises revolutionary applications ranging from light detection and ranging (LiDAR) to holographic displays. Although semiconductor manufacturing of nanophotonics in Silicon ... » read more

Chip Industry Week In Review
By The SE Staff - 06 Oct, 2023 - Comments: 0

By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Chip Industry’s Technical Paper Roundup: September 26
By Liz Allan - 26 Sep, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=146 /] More Reading Technical Paper Library home » read more

Photonic-Electronic SmartNIC With Fast and Energy-Efficient Photonic Computing Cores (MIT)
By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “Lightning: A Reconfigurable Photonic-Electronic SmartNIC for Fast and Energy-Efficient Inference” was published by researchers at Massachusetts Institute of Technology (MIT). Abstract: "The massive growth of machine learning-based applications and the end of Moore's law have created a pressing need to redesign computing platforms. We propose Lightning, the first ... » read more

Chip Industry Week In Review
By The SE Staff - 15 Sep, 2023 - Comments: 0

By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

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