tag: MIT

Chip Industry Technical Paper Roundup: June 10
By Linda Christensen - 10 Jun, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=232 /] More ReadingTechnical Paper Library home » read more

Research Bits: June 4
By Jesse Allen - 04 Jun, 2024 - Comments: 0

Ultra-pure silicon Researchers from the University of Manchester and University of Melbourne developed a technique to engineer ultra-pure silicon that could be used in the construction of high-performance qubit devices that extend quantum coherence times. The highly purified silicon chips house and protect the qubits so they can sustain quantum coherence much longer, enabling complex calcul... » read more

Chip Industry Week In Review
By The SE Staff - 31 May, 2024 - Comments: 0

JEDEC and the Open Compute Project rolled out a new set of guidelines for standardizing chiplet characterization details, such as thermal properties, physical and mechanical requirements, and behavior specs. Those details have been a sticking point for commercial chiplets, because without them it's not possible to choose the best chiplet for a particular application or workload. The guidelines ... » read more

GaN Devices: Properties and Performance At Extremely High Temperatures
By Technical Paper Link - 28 May, 2024 - Comments: 0

A new technical paper titled "High temperature stability of regrown and alloyed Ohmic contacts to AlGaN/GaN heterostructure up to 500 °C" was published by researchers at MIT, Technology Innovation Institute, Ohio State University, Rice University and Bangladesh University of Engineering and Technology. Abstract "This Letter reports the stability of regrown and alloyed Ohmic contacts to A... » read more

Chip Industry Week In Review
By The SE Staff - 10 May, 2024 - Comments: 0

Synopsys refocused its security priorities around chips, striking a deal to sell off its Software Integrity Group subsidiary to private equity firms Clearlake Capital Group and Francisco Partners for about $2.1 billion. That deal comes on the heels of Synopsys' recent acquisition of Intrinsic ID, which develops physical unclonable function IP. Sassine Ghazi, Synopsys' president and CEO, said in... » read more

Fundamental Issues In Computer Vision Still Unresolved
By Karen Heyman - 02 May, 2024 - Comments: 1

Given computer vision’s place as the cornerstone of an increasing number of applications from ADAS to medical diagnosis and robotics, it is critical that its weak points be mitigated, such as the ability to identify corner cases or if algorithms are trained on shallow datasets. While well-known bloopers are often the result of human decisions, there are also fundamental technical issues that ... » read more

Research Bits: April 30
By Jesse Allen - 30 Apr, 2024 - Comments: 0

Sound waves in optical neural networks Researchers from the Max Planck Institute for the Science of Light and Massachusetts Institute of Technology found a way to build reconfigurable recurrent operators based on sound waves for photonic machine learning. They used light to create temporary acoustic waves in an optical fiber, which manipulate subsequent computational steps of an optical rec... » read more

Chip Industry Week In Review
By The SE Staff - 26 Apr, 2024 - Comments: 0

President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic context and progress updates for the President’s workforce strategy. Samsung began mass production of its ninth-gen industry-first V-NAND chip. Along with one-terabit triple-level cell design, th... » read more

Chip Industry Technical Paper Roundup: April 23
By Linda Christensen - 23 Apr, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=216 /] Find last week’s technical paper additions here. » read more

Chip Industry Week In Review
By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

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