Big Changes In Architectures, Transistors, Materials


Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process steps, increased complexity for each of those steps, and rising costs across the board. At the leading-edge, finFETs will run out of steam somewhere after the 3nm (30 angstrom) node. The three foundries still working at th... » read more

Cryogenic CMOS Becomes Cool


Cryogenic CMOS is a technology on the cusp, promising higher performance and lower power with no change in fabrication technology. The question now is whether it becomes viable and mainstream. Technologies often appear to be just on the horizon, not quite making it, but never too far out of sight. That's usually because some issue plagues it, and the incentive is not big enough to solve the ... » read more

Scaling, Advanced Packaging, Or Both


Chipmakers are facing a growing number of challenges and tradeoffs at the leading edge, where the cost of process shrinks is already exorbitant and rising. While it's theoretically possible to scale digital logic to 10 angstroms (1nm) and below, the likelihood of a planar SoC being developed at that nodes appears increasingly unlikely. This is hardly shocking in an industry that has heard pr... » read more

Memory Evolution Drives Requirements For Design Technology Co-Optimization


By Ricardo Borges and Anand Thiruvengadam As new technology nodes have become available, memory has been one of the most aggressive semiconductor applications to adopt advanced process technology. The relentless demand by users of electronic devices for more memory has ensured that investments in new nodes and processes would be quickly repaid by massive sales volumes. As each new node came ... » read more

MIT: Computing Power Impact on 5 Domains


New technical paper titled "The Importance of (Exponentially More) Computing Power" from researchers at MIT CSAIL and Sloan School of Management. Abstract "Denizens of Silicon Valley have called Moore's Law "the most important graph in human history," and economists have found that Moore's Law-powered I.T. revolution has been one of the most important sources of national productivity growth... » read more

What Future Processors Will Look Like


Mark Papermaster, CTO at AMD, sat down with Semiconductor Engineering to talk about architectural changes that are required as the benefits of scaling decrease, including chiplets, new standards for heterogeneous integration, and different types of memory. What follows are excerpts of that conversation. SE: What does a processor look like in five years? Is it a bunch of chips in a package? I... » read more

Standardizing Chiplet Interconnects


The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

New End Markets, More Demand For Complex Chips


Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front... » read more

More Options, Less Dark Silicon


Chipmakers are beginning to re-examine how much dark silicon should be used in a heterogenous system, where it works best, and what alternatives are available — a direct result of a slowdown in Moore's Law scaling and the increasing disaggregation of SoCs. The concept of dark silicon has been around for a couple decades, but it really began taking off with the introduction of the Internet ... » read more

Planning EDA’s Next Steps


Anirudh Devgan, Cadence's new CEO, and the recipient of the Phil Kaufman Award in December, sat down with Semiconductor Engineering to talk about what's next in EDA, the underlying technology and business challenges and changes, and new markets that are unfolding for floor-planning, verification, CFD, and advanced packaging. SE: Where does EDA need to improve? Devgan: We have made it much... » read more

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