tag: Moore’s Law

Winners And Losers At The Edge
By Ed Sperling - 01 Jul, 2020 - Comments: 0

The edge is a vast collection of niches tied to narrow vertical markets, and it is likely to stay that way for years to come. This is both good and bad for semiconductor companies, depending upon where they sit in the ecosystem and their ability to adapt to a constantly shifting landscape. Some segments will see continued or new growth, including EDA, manufacturing equipment, IP, security an... » read more

New Approaches For Dealing With Thermal Problems
By Ann Mutschler - 11 Jun, 2020 - Comments: 0

New thermal monitoring, simulation and analysis techniques are beginning to coalesce in chips developed at leading-edge nodes and in advanced packages in order to keep those devices running at optimal temperatures. This is particularly important in applications such as AI, automotive, data centers and 5G. Heat can kill a chip, but it also can cause more subtle effects such as premature aging... » read more

Making Silicon Photonics Chips More Reliable
By Ed Sperling - 09 Jun, 2020 - Comments: 0

Silicon photonics has the ability to dramatically improve on-die and chip-to-chip communication within a package at extremely low power, but ensuring that signal integrity remains consistent over time isn't so simple. While this technology has been used commercially for at least the past decade, it never has achieved mainstream status. That's mostly due to the fact that Moore's Law scaling h... » read more

Domain-Specific Processors Enable More Than Moore
By Roddy Urquhart - 28 May, 2020 - Comments: 0

Last month was the 55th anniversary of Gordon Moore’s famous paper Cramming more components onto integrated circuits. He took a long-term view of the trends in integrated circuits being implemented using successively smaller feature sizes in silicon. Since that paper, integrated circuit developers have been relying on three of his predictions: The number of transistors per chip increas... » read more

3nm: Blurring Lines Between SoCs, PCBs And Packages
By Ann Mutschler - 02 Mar, 2020 - Comments: 5

Leading-edge chipmakers, foundries and EDA companies are pushing into 3nm and beyond, and they are encountering a long list of challenges that raise questions about whether the entire system needs to be shrunk onto a chip or into a package. For 7nm and 5nm, the problems are well understood. In fact, 5nm appears to be more of an evolution from 7nm than a major shift in direction. But at 3nm, ... » read more

Chiplet Momentum Rising
By Mark LaPedus - 26 Feb, 2020 - Comments: 0

The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

Moore And More
By Paul McLellan - 13 Feb, 2020 - Comments: 0

For more than 50 years, the semiconductor industry has enjoyed the benefits of Moore's Law — or so it seemed. In reality, there were three laws rolled up into one: Each process generation would have a higher clock speed at the same power. This was not discovered by Moore, but by Dennard, who also invented the DRAM. Process generations continue to get faster and lower power, but the power... » read more

Bigger, Faster, More Diverse And Expensive
By Ed Sperling - 06 Feb, 2020 - Comments: 0

Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to talk about the race toward AI everywhere, how splintering markets are affecting design, and why software is now such a critical component of hardware development. SE: We're seeing big advances in compute performance due to advanced packaging and heterogeneous architectures. Is that sustainable? de Ge... » read more

More Knobs, Fewer Markers
By Ed Sperling - 16 Jan, 2020 - Comments: 0

The next big thing in chip design may be really big — the price tag. In the past, when things got smaller, so did the cost per transistor. Now they are getting more expensive to design and manufacture, and the cost per transistor is going up along with the number of transistors per area of die, and in many cases even the size of the die. That's not exactly a winning economic formula, which... » read more

Moore’s Law, Supply Chains And Security
By Brian Bailey - 16 Jan, 2020 - Comments: 0

The debate about the future of Moore's Law continues, while other parts of the industry look for alternatives. In between, supply chains are being pulled in multiple directions, with safety and security often in the middle. All across the semiconductor industry, significant changes are underway. Some of these have been in the works for some time. Others are new or accelerating faster than an... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy