tag: Multibeam

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Oct, 2019 - Comments: 0

Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

Lithography Options For Next-Gen Devices
By Mark LaPedus - 18 Apr, 2019 - Comments: 2

Chipmakers are ramping up extreme ultraviolet (EUV) lithography for advanced logic at 7nm and/or 5nm, but EUV isn’t the only lithographic option on the table. For some time, the industry has been working on an assortment of other next-generation lithography technologies, including a new version of EUV. Each technology is different and aimed at different applications. Some are here today, w... » read more

New Approaches To Security
By Ed Sperling - 09 Apr, 2019 - Comments: 0

Different approaches are emerging to identify suspicious behavior and shut down potential breaches before they have a chance to do serious damage. This is becoming particularly important in markets where safety is an issue, and in AI and edge devices where the rapid movement of data is essential. These methods are a significant departure from the traditional way of securing devices through l... » read more

Manufacturing Bits: Feb. 5
By Mark LaPedus - 05 Feb, 2019 - Comments: 1

Multi-beam litho shakeout The multi-beam e-beam market for lithography applications continues to undergo a shakeout amid technical roadblocks and other issues. Last week, ASML announced that it had acquired the intellectual-property (IP) assets of Mapper Lithography, a Dutch supplier of multi-beam e-beam tools for lithography applications that fell into bankruptcy late last year. As it t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Manufacturing Bits: March 6
By Mark LaPedus - 06 Mar, 2018 - Comments: 0

Security ICs with multi-beam Leti, a research institute of CEA Tech, and Mapper Lithography have developed a new application for its multi-beam, direct-write lithography technology—security. In 2016, Mapper Lithography introduced the FLX-1200, a direct-write, multi-beam e-beam system. Using a 5-kV acceleration voltage, a beam generator creates an electron beam about 3cm in diameter. Then,... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 May, 2017 - Comments: 0

Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

Moore’s Law: A Status Report
By Ed Sperling - 20 Apr, 2017 - Comments: 3

Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

What’s Next For IoT Security?
By Ed Sperling - 07 Nov, 2016 - Comments: 0

By Ed Sperling & Jeff Dorsch With security, the little things can cause as much of a problem as the big things. As shown in the recent distributed denial of service attack (DDoS) on Dyn, which created waves of attacks using Mirai malware, connected devices of all sizes can be amassed into an army of bots that can bring even giants like Amazon and Netflix to a dead stop. This attack was ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Oct, 2016 - Comments: 0

Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

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