tag: Multibeam

Week In Review: Manufacturing, Test
By Mark LaPedus - 13 Jul, 2018 - Comments: 0

Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Manufacturing Bits: March 6
By Mark LaPedus - 06 Mar, 2018 - Comments: 0

Security ICs with multi-beam Leti, a research institute of CEA Tech, and Mapper Lithography have developed a new application for its multi-beam, direct-write lithography technology—security. In 2016, Mapper Lithography introduced the FLX-1200, a direct-write, multi-beam e-beam system. Using a 5-kV acceleration voltage, a beam generator creates an electron beam about 3cm in diameter. Then,... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 May, 2017 - Comments: 0

Chipmakers Samsung has formed a new foundry division and rolled out a range of new processes. Specifically, Samsung plans to develop 8nm, 7nm, 6nm, 5nm and 4nm. It also introduced an 18nm FD-SOI technology. GlobalFoundries has provided more details about its 300mm fab plans in China. The company and the Chengdu municipality have announced an investment to develop an ecosystem for its 22nm ... » read more

Moore’s Law: A Status Report
By Ed Sperling - 20 Apr, 2017 - Comments: 3

Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

What’s Next For IoT Security?
By Ed Sperling - 07 Nov, 2016 - Comments: 0

By Ed Sperling & Jeff Dorsch With security, the little things can cause as much of a problem as the big things. As shown in the recent distributed denial of service attack (DDoS) on Dyn, which created waves of attacks using Mirai malware, connected devices of all sizes can be amassed into an army of bots that can bring even giants like Amazon and Netflix to a dead stop. This attack was ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Oct, 2016 - Comments: 0

Chipmakers Alain Kaloyeros, president of SUNY Polytechnic Institute, has resigned. This comes amid charges that Kaloyeros was involved in an alleged bid-rigging scheme, according to multiple reports. SUNY Poly, a high-tech educational ecosystem in New York, was recently formed from the merger of the SUNY College of Nanoscale Science and Engineering (CNSE) and the SUNY Institute of Technology. ... » read more

Securing Chips During Manufacturing
By Ed Sperling - 07 Jul, 2016 - Comments: 0

David Lam, chairman of Multibeam, sat down with Semiconductor Engineering to talk about how next-gen lithography tools can be used to prevent cyber attacks and counterfeiting of hardware. SE: How did you get into the anti-counterfeiting business? Lam: About three years ago we were working with some customers that were troubled by the counterfeiting problem. We became aware of that sense o... » read more

7nm Lithography Choices
By Mark LaPedus - 07 Mar, 2016 - Comments: 2

Chipmakers are ramping up their 16nm/14nm logic processes, with 10nm expected to move into early production later this year. Barring a major breakthrough in lithography, chipmakers are using today’s 193nm immersion and multiple patterning for both 16/14nm and 10nm. Now, chipmakers are focusing on the lithography options for 7nm. For this, they hope to use a combination of two technologies ... » read more

Inside Multi-Beam E-Beam Lithography
By Mark LaPedus - 19 Nov, 2015 - Comments: 4

Semiconductor Engineering sat down with David Lam, chairman of Multibeam, a developer of multi-beam e-beam tools for direct-write lithography applications. Lam is also a venture capitalist. He founded Lam Research in 1980, but left as an employee in 1985. What follows are excerpts of that conversation. SE: How has the equipment business changed over the years and what’s the state of the i... » read more

The Price Of Consolidation
By Ed Sperling - 24 Sep, 2015 - Comments: 0

Consolidation is causing far-reaching changes across the global semiconductor ecosystem due to the size of companies being bought and the dearth of startups to replenish those being acquired. Coupled with the rising cost and difficulty of shrinking features down to advanced process nodes—many argue that is the largest driver of consolidation—the market dynamics for who's buying IP, EDA t... » read more

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