中文 English

In-NAND Flash Processing Technique for Improved Performance, Energy Efficiency & Reliability of Bulk Bitwise Operations


A new technical paper titled "Flash-Cosmos: In-Flash Bulk Bitwise Operations Using Inherent Computation Capability of NAND Flash Memory" was published by researchers at ETH Zurich, POSTECH, LIRMM/Univ. Montpellier/CNRS and Kyungpook National University. Find the technical paper here (published September 2022) and related YouTube lecture here. "We propose Flash-Cosmos (Flash Computation wi... » read more

How Memory Design Optimizes System Performance


Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on the memory side. While the underlying technology still looks very familiar, the real shift is in the way those memories are connected to processing elements and various components within a syste... » read more

Week In Review: Manufacturing, Test


Some funding details are now available for the CHIPS Act in the U.S. The Biden Administration plans to spend the money in the following ways: $28 billion to establish domestic production of leading-edge logic and memory chips through grants, subsidized loans or loan guarantees; $10 billion to increase production of current-generation semiconductors and chips, and $11 billion for rese... » read more

Technology Advances, Shortages Seen For Wire Bonders


A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs As reported, Intel this week reorganized its operations following delays with its 7nm technology. Intel is behind TSMC and Samsung in technology. As a result, TSMC’s foundry customers, such as AMD, Nvidia and others, are also pulling ahead of Intel. In addition, reports have surfaced that Intel will outsource some of its leading-edge chip production to TSMC. To solve t... » read more

Week In Review: Manufacturing, Test


Fab tools and test KLA has announced the formation of a new business group for its Electronics, Packaging and Components (EPC) businesses. The new EPC group includes the ICOS, Orbotech and the SPTS Technologies organizations. The group will be headed by Oreste Donzella, KLA’s executive vice president. In 2018, KLA acquired Orbotech for $3.4 billion, a deal that included two organizations-... » read more

What Is DRAM’s Future?


Memory — and DRAM in particular — has moved into the spotlight as it finds itself in the critical path to greater system performance. This isn't the first time DRAM has been the center of attention involving performance. The problem is that not everything progresses at the same rate, creating serial bottlenecks in everything from processor performance to transistor design, and even the t... » read more

Week in Review: IoT, Security, Auto


Internet of Things Tony Franklin, Intel’s general manager for Internet of Things Segments, is interviewed by Lorin Fries on how the chipmaker is helping to develop smart farming applications. “We focus primarily on high-performance computer technologies, as well as communication technologies, which have great applicability for food systems. We work closely with a broad ecosystem of partner... » read more

Tech Talk: Data-Driven Design


Steven Woo, distinguished inventor at Rambus, talks about memory hierarchies and how they are changing as the amount of data continues to grow. https://youtu.be/4FwZ1YeQa18 » read more

ATE Tailwind For 2018?


The automatic test equipment market enjoyed a record sales year during 2017, and there are indications that the good times will continue this year. Forecasters are predicting another robust year for sales of DRAMs and NAND flash memory devices, especially 3D NAND. That will drive demand for memory test equipment to keep up. Frost & Sullivan predicts semiconductor test equipment will h... » read more

← Older posts