Week In Review: Auto, Security, Pervasive Computing


AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

A Promising Future For Interconnect IP


Complexity of SoC designs continues to increase primarily due to increased demand for functionality and performance in all electronic devices. Studies that Semico Research has conducted on the SoC design landscape shows the number of discrete SIP blocks has continued to rise in response to increased market requirements from new applications and richer feature sets. Table 1: Comparison of 1st... » read more

CXL Vs. CCIX


Kurt Shuler, vice president of marketing at ArterisIP, explains how these two standards differ, which one works best where, and what each was designed for. » read more

Power Dissipation Of The Network-On-Chip In A System-on-Chip For MPEG-4 Video Encoding


An oldie but a goodie: Explains power benefits of NoC technology by characterizing a multi-processor system-on-chip (MPSoC) for MPEG4, AVC/H.264 encoding. Explains NoC power model used to analyze power consumption and dissipation. Includes: Description of multi-processor system-on-chip (MPSoC) for Multi-Processor System-on-Chip (MPSoC) for MPEG4, AVC/H.264 encoding Explanation of N... » read more

Safety Islands In Safety-Critical Hardware


Safety and security have certain aspects in common so it shouldn’t be surprising that some ideas evolving in one domain find echoes in the other. In hardware design, a significant trend has been to push security-critical functions into a hardware root-of-trust (HRoT) core, following a philosophy of putting all (or most) of those functions in one basket and watching that basket very carefully.... » read more

In-System Networks Are Front And Center


This year’s HotChips conference at Stanford was all about artificial intelligence (AI) and machine learning (ML) and what particularly struck me, naturally because we’re in this business too, was how big a role on-chip networks played in some of the leading talks. NVIDIA talked about their scalable mesh architecture, both on-chip and in-package, meshes connecting processing NN processing el... » read more

5G Design Changes


Mike Fitton, senior director of strategic planning at Achronix, talks with Semiconductor Engineering about the two distinct parts of 5G deployment, how to get a huge amount of data from the core to the edge of a device where it is usable, and how a network on chip can improve the flow of data. » read more

Speeding Up AI


Robert Blake, president and CEO of Achronix, sat down with Semiconductor Engineering to talk about AI, which processors work best where, and different approaches to accelerate performance. SE: How is AI affecting the FPGA business, given the constant changes in algorithms and the proliferation of AI almost everywhere? Blake: As we talk to more and more customers deploying new products and... » read more

Interconnect Prominence In Fail-Operational Architectures


When we in the semiconductor world think about safety, we think about ISO 26262, FMEDA and safety mechanisms like redundancy, ECC and lock-step operation. Once we have that covered, any other aspect of safety is somebody else’s problem, right? Sadly no, for us at least. As we push towards higher levels of autonomy, SAE levels 3 and above, we’re integrating more functionality into our SoCs, ... » read more

Memory Architectures In AI: One Size Doesn’t Fit All


In the world of regular computing, we are used to certain ways of architecting for memory access to meet latency, bandwidth and power goals. These have evolved over many years to give us the multiple layers of caching and hardware cache-coherency management schemes which are now so familiar. Machine learning (ML) has introduced new complications in this area for multiple reasons. AI/ML chips ca... » read more

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