tag: Nordson

Case Study — 3D Wire Bond Inspection and Metrology
By CyberOptics - 12 Apr, 2022 - Comments: 0

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

Fundamental Shifts In IC Manufacturing Processes
By Ed Sperling - 14 Mar, 2022 - Comments: 2

High chip value and 3D packaging are changing where and how tests are performed, tightening design-for-reliability and accelerating the shift of tools from lab to fab. Heterogeneous integration and more domain-specific designs are causing a string of disruptions for chip manufacturers, up-ending proven fab processes and methodologies, extending the time it takes to manufacture a chip, and ul... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Feb, 2022 - Comments: 0

Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 11 Feb, 2022 - Comments: 0

Pervasive computing, IoT and 5G Infineon added to its NFC (near-field communications) IP by acquiring NFC patent portfolios from France Brevets and Verimatrix. “With this acquisition, Infineon further strengthens its IP and technology portfolio, specifically in our leadership markets for security and connectivity for the IoT,” said Thomas Rosteck, president of Infineon’s Connected Secure... » read more

Unknowns Driving Up The Cost Of Auto IC Reliability
By Ed Sperling - 08 Feb, 2022 - Comments: 2

Automotive chipmakers are considering a variety of options to improve the reliability of ICs used for everything from sensors to artificial intelligence. But collectively they could boost the number of process steps, increase the time spent in manufacturing and packaging, and stir up concerns about the amount of data that needs to be collected, shared, and stored. Accounting for advanced pro... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Jan, 2022 - Comments: 0

Fabs Intel has announced plans for an initial investment of more than $20 billion in the construction of two new leading-edge fabs in Ohio. Planning for the first two factories will start immediately, with construction expected to begin late in 2022. Production is expected to come online in 2025. As part of the announcement, Air Products, Applied Materials, Lam Research and Ultra Clean Technol... » read more

SOT-MRAM To Challenge SRAM
By Bryon Moyer - 13 Jan, 2022 - Comments: 1

In an era of new non-volatile memory (NVM) technologies, yet another variation is poised to join the competition — a new version of MRAM called spin-orbit torque, or SOT-MRAM. What makes this one particularly interesting is the possibility that someday it could supplant SRAM arrays in systems-on-chip (SoCs) and other integrated circuits. The key advantages of SOT-MRAM technology are the pr... » read more

The Gargantuan 5G Chip Challenge
By Ed Sperling - 11 Jan, 2022 - Comments: 0

Blazing fast upload and download speeds for cellular data are coming, but making the technology function as expected throughout its expected lifetime is an enormous challenge that will require substantial changes across the entire chip ecosystem. While sub-6GHz is an evolutionary step from 4G LTE, the real promise of 5G kicks in with millimeter-wave (mmWave) technology. But these higher-freq... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Jan, 2022 - Comments: 0

Fab tools A fire broke out this week within ASML’s factory in Berlin, Germany. The fire was quickly extinguished and no one was injured during this incident. The factory manufactures components for ASML’s lithography systems, including wafer tables and clamps, reticle chucks and mirror blocks. The fire took place on Jan. 3. On Jan. 7, ASML provided an update. "The manufacturing of DUV c... » read more

2021 Top Tech Videos
By Linda Christensen - 28 Dec, 2021 - Comments: 0

While the world’s chip shortage dominated the 2021 headlines, the semiconductor industry blazed new trails with the increased electrification of cars, focused AI applications, improving power/performance, better utilization of data deluges, dealing with design challenges in advanced nodes and much more focus on chip security. Semiconductor Engineering’s Tech Talks reflected these focus a... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy