FP8: Cross-Industry Hardware Specification For AI Training And Inference (Arm, Intel, Nvidia)


Arm, Intel, and Nvidia proposed a specification for an 8-bit floating point (FP8) format that could provide a common interchangeable format that works for both AI training and inference and allow AI models to operate and perform consistently across hardware platforms. Find the technical paper titled " FP8 Formats For Deep Learning" here. Published Sept 2022. Abstract: "FP8 is a natural p... » read more

Week In Review: Manufacturing, Test


President Biden signed an executive order on Sept. 15, limiting foreign investments in U.S. technology by "competitor or adversarial nations" that are deemed a threat to national security. In the past, the Committee on Foreign Investment in the United States (CFIUS) largely limited its actions to the sale of U.S. companies. The new directive expands that to include investments involving "U.S. s... » read more

Week In Review: Design, Low Power


Cadence unveiled a big data analytics infrastructure to unify massive data sets across all Cadence computational software. The Joint Enterprise Data and AI (JedAI) Platform aims to optimize multiple runs of multiple engines across an entire SoC design and verification flow. It combines data from its AI-driven Cerebrus implementation and Optimality system optimization solutions, along with the n... » read more

Challenges Mount In New Autos


Electronics are becoming the primary differentiator for carmakers, adding an array of options that can alter everything from how a vehicle's occupants interact with their surroundings to how the vehicle drives. But the infrastructure needed to support these features also raises a slew of technology and business questions for which there are no simple answers today. For example, how will new ... » read more

Week In Review: Design, Low Power


Trade regulations/legal The U.S. government placed new restrictions on sales of GPUs to China that could be used for high-performance computing, artificial intelligence, and other advanced applications. NVIDIA said in an SEC filing Wednesday that officials told the company it must seek an export license for sales to China or Russia of its A100 and H100 chips, and any system that includes those... » read more

Chipmakers Model AI For Radio Access Networks


The chips that power and connect smartphones are now foundational to a disparate portfolio of daily tasks we take for granted, from accessing the internet to snapping a photo or asking Siri or Google if rain is in the forecast. Most people don’t think twice about the conflicting demands these tasks can place on semiconductors, but for engineers at leading chip manufacturers, this balancing ac... » read more

Techniques For Improving Energy Efficiency of Training/Inference for NLP Applications, Including Power Capping & Energy-Aware Scheduling


This new technical paper titled "Great Power, Great Responsibility: Recommendations for Reducing Energy for Training Language Models" is from researchers at MIT and Northeastern University. Abstract: "The energy requirements of current natural language processing models continue to grow at a rapid, unsustainable pace. Recent works highlighting this problem conclude there is an urgent need ... » read more

New Uses For AI In Chips


Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing, connectivity Semtech Corporation announced that it will acquire Sierra Wireless, an IoT services company. The acquisition will combine Semtech’s LoRa end nodes and cloud service with Sierra Wireless’ cellular capabilities. Telit will incorporate Thales’s cellular IoT products business under a new name Telit Cinterion, led by Telit. Telit Cinterion will be Californ... » read more

Blog Review: July 27


Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

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