tag: NXP

Could Liquid IP Lead To Better Chips? (Part 3)
By Brian Bailey - 09 Jan, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss the benefits that could come from making IP available as abstract blocks instead of RTL implementations with Mark Johnstone, technical director for Electronic Design Automation for [getentity id="22499" e_name="NXP"] Semiconductor; [getperson id="11489" p_name="Drew Wingard"], CTO at [getentity id="22605" e_name="Sonics"]; Bryan Bowyer, director of ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 05 Jan, 2018 - Comments: 0

Chipmakers Semiconductor IP startup eVaderis has demonstrated a design platform through an ultra-low-power microcontroller (MCU) in Beyond Semiconductor’s BA2X product line. The software, system and memory IP developed by eVaderis make Beyond Semiconductor’s new MCU ideally suited for battery-powered applications in IoT and wearable electronics. By incorporating the latest STT-MRAM tec... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Dec, 2017 - Comments: 0

Chipmakers Apple has announced the latest award from its $1 billion Advanced Manufacturing Fund. Finisar, a manufacturer of optical communications components, will receive $390 million in funds from Apple. The award will enable Finisar to increase its R&D spending and high-volume production of vertical-cavity surface-emitting lasers (VCSELs). A VCSEL is a type of semiconductor laser diode. The... » read more

Could Liquid IP Lead To Better Chips?
By Brian Bailey - 13 Dec, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the benefits that could come from making IP available as abstract blocks instead of RTL implementations with Mark Johnstone, technical director for Electronic Design Automation for [getentity id="22499" e_name="NXP"] Semiconductor; [getperson id="11489" p_name="Drew Wingard"], CTO at [getentity id="22605" e_name="Sonics"]; Bryan Bowyer, director of ... » read more

Shortages Hit Packaging Biz
By Mark LaPedus - 11 Dec, 2017 - Comments: 1

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

Could Liquid IP Lead To Better Chips?
By Brian Bailey - 30 Nov, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the benefits that could come from making IP available as abstract blocks instead of RTL implementations with Mark Johnstone, technical director for Electronic Design Automation for [getentity id="22499" e_name="NXP"] Semiconductor; [getperson id="11489" p_name="Drew Wingard"], CTO at [getentity id="22605" e_name="Sonics"]; Bryan Bowyer, director of ... » read more

The New Road Warriors
By Jeff Dorsch - 27 Nov, 2017 - Comments: 0

Chip vendors and other companies that have little or no experience in automotive are flooding into this market as the race for assisted and autonomous driving begins to heat up. This market is expected to pay big dividends for companies that succeed in helping to build the vehicles of the future in this century. IC Insights earlier this year forecast the auto chip market would grow 22% this ... » read more

Deals: Mentor-Solido, Marvell-Cavium
By Ed Sperling - 20 Nov, 2017 - Comments: 0

Marvell today signed a definitive agreement to buy Cavium for roughly $6 billion, ending weeks of speculation about whether the deal would go through. And Mentor, a Siemens business, paid an undisclosed price to buy Solido Design Automation, which tracks variation in complex designs. Both deals are part of a new flurry of M&A activity across the semiconductor industry as the industry ret... » read more

Here Comes High-Res Car Radar
By Mark LaPedus - 20 Nov, 2017 - Comments: 1

A dozen or so startups are developing high-resolution radar chips that use various modulation schemes and processes, such as CMOS, FD-SOI and even metamaterials. In theory, high-resolution radar could boost the capabilities of today’s radar for cars, as well as eliminate the need for a separate LiDAR system. But the technology is still in the research stage and has yet to be proven commerc... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

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