tag: Onto Innovation

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Removing Barriers For End-To-End Analytics
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end analytics. While the promise of big data analytics is well understood, data sharing through the semiconductor supply chain has been stymied by an inability to link together data sources throughout the lifecycle of a chip, package, or ... » read more

Center Stage: The Time For Hybrid Bonding Has Arrived
By Woo Young Han - 07 Jun, 2022 - Comments: 0

When the subject of hybrid bonding is brought up in the industry, the focus is often on how this technique is used to manufacture CMOS image sensors (CIS), an essential device for today’s digital cameras, particularly those found in smartphones. As such, CIS is a common touchpoint given the ubiquity of mobile phones, whether you hold a product from Apple, Samsung, or Huawei in your hands. ... » read more

The Race To Zero Defects In Auto ICs
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the number of costly returns. Today, assembly defects account for between 12% and 15% of semiconductor customer returns in the automotive chip market. As component counts in vehicles climb from the ... » read more

Where And When End-to-End Analytics Works
By Anne Meixner - 10 May, 2022 - Comments: 0

With data exploding across all manufacturing steps, the promise of leveraging it from fab to field is beginning to pay off. Engineers are beginning to connect device data across manufacturing and test steps, making it possible to more easily achieve yield and quality goals at lower cost. The key is knowing which process knob will increase yield, which failures can be detected earlier, and wh... » read more

Paving The Way For 5G: RF Filter Process Monitoring And Control Using Picosecond Ultrasonic Metrology
By Johnny Dai - 10 May, 2022 - Comments: 0

A recent study shows the radio frequency (RF) filter market growing steadily by nearly $16 billion from 2019 to 2024 at a compound annual growth rate (CAGR) of approximately 20%, according to Technavio. The strong growth in the RF filter market is driven by the increased adoption of 5G technology, the surge in smartphones using 5G, and commercial and consumer devices dependent on internet of th... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 06 May, 2022 - Comments: 0

Acquisitions & Investments California-based MaxLinear plans to acquire Taiwan-based Silicon Motion (SMI), in a cash and stock deal valued at about $3.8 billion. Silicon Motion’s NAND flash controller technology for solid state storage devices, will extend MaxLinear’s RF, analog, and mixed signal portfolio. ISMC will invest about $3 billion in a semiconductor plant in India’s south... » read more

Nip The Defect In The Bud
By Melvin Lee - 12 Apr, 2022 - Comments: 0

As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address specific technology nodes optimizes a chip’s performance regarding that functionality, this performance comes at a cost: additional chips will need to be designed, developed, processed, and assembl... » read more

Week In Review: Manufacturing, Test
By Ed Sperling - 25 Mar, 2022 - Comments: 0

Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Highly Selective Etch Rolls Out For Next-Gen Chips
By Mark LaPedus - 21 Mar, 2022 - Comments: 0

Several etch vendors are starting to ship next-generation selective etch tools, paving the way for new memory and logic devices. Applied Materials was the first vendor to ship a next-gen selective etch system, sometimes called highly-selective etch, in 2016. Now, Lam Research, TEL, and others are shipping tools with highly-selective etch capabilities, in preparation for futuristic devices su... » read more

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