Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation

By Synopsys - 24 Oct, 2024 - Comments: 0

Disruptive AR systems will push the limits of optics: limits in design, limits in manufacturing, and limits in overall system integration. The trend of optical components being integrated into more complex miniaturized systems is impacting optical software. Optical design software has been around for decades to design, simulate, and analyze any optical component from lenses and mirrors to light... » read more

PCIe Over Optical: Transforming High-Speed Data Transmission

By David Kulansky - 29 Aug, 2024 - Comments: 0

With the rise in AI requiring new computing models and enhanced data transmission methods to cope, the necessity for innovative, high-performance, and low-latency connectivity solutions has never been more apparent. PCIe over Optical is set to play a key role in enabling the growth of AI, and here we examine some of the intricacies of PCIe over Optical to explore its implementation, challenges,... » read more

Next-Gen High-Speed Communication In Data Centers

By Ed Sperling - 21 Aug, 2024 - Comments: 0

Data centers are being flooded with data. While more of it needs to be processed locally, much of it also needs to be moved around within a system and between systems. This has put a spotlight on a variety of new optical technologies and methodologies. Yang Zhang, senior product marketing manager at Cadence, talks about the rapid increase in different types of optics and optical scenarios being... » read more

The Race To Zero Defects In Auto ICs

By Anne Meixner - 07 Jun, 2022 - Comments: 0

Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the number of costly returns. Today, assembly defects account for between 12% and 15% of semiconductor customer returns in the automotive chip market. As component counts in vehicles climb from the ... » read more

Stress tensor mesostructures for deterministic figuring of thin substrates

By Technical Paper Link - 21 Apr, 2022 - Comments: 0

New research paper from MIT and University of Arizona, funded by NASA. Abstract "Accessing the immense value of freeform surfaces for mass-sensitive applications such as space optics or metaform optical components requires fabrication processes that are suited to figuring thin substrates. We present stress tensor mesostructures for precisely correcting figure errors, even after microstruc... » read more

Graphene oxide 2D films integrated with nanowires and ring resonators for enhanced nonlinear optics

By Technical Paper Link - 12 Apr, 2022 - Comments: 0

New research paper from Optical Sciences Centre, Swinburne University of Technology. Abstract "We report enhanced nonlinear optics in nanowires, waveguides, and ring resonators by introducing layered two-dimensional (2D) graphene oxide (GO) films through experimental demonstration. The GO films are integrated on silicon-on-insulator nanowires (SOI), high index doped silica glass, and sili... » read more

An achromatic X-ray lens

By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract "Diffractive and refractive optical elements have become an integral part of most high-resolution X-ray microscopes. However, they suffer from inherent chromatic aberration. This has to date restricted their use to narrow-bandwidth radiation, essentially limiting such high-resolution X-ray microscopes to high-brightness synchrotron sources. Similar to visible light optics, one way t... » read more

Electro-optic spatial light modulator from an engineered organic layer

By Technical Paper Link - 27 Jan, 2022 - Comments: 0

Abstract "Tailored nanostructures provide at-will control over the properties of light, with applications in imaging and spectroscopy. Active photonics can further open new avenues in remote monitoring, virtual or augmented reality and time-resolved sensing. Nanomaterials with χ(2) nonlinearities achieve highest switching speeds. Current demonstrations typically require a trade-off: they eith... » read more

Power/Performance Bits: Jan. 25

By Jesse Allen - 25 Jan, 2022 - Comments: 0

Nanoscale 3D optics Researchers at Rice University and University of Houston are using 3D printing to build nanostructures of silica for micro-scale electronic, mechanical, and photonic devices. “It’s very tough to make complicated, three-dimensional geometries with traditional photolithography techniques,” said Jun Lou, a professor of materials science and nanoengineering at Rice. �... » read more

The Role of InGaN Quantum Barriers in Improving the Performance of GaN-based Laser Diodes

By Technical Paper Link - 21 Dec, 2021 - Comments: 0

Abstract: "In this work, different aspects which have influences on device performance of blue laser diodes (LDs) when using InGaN instead of GaN as quantum barrier (QB) layers are investigated theoretically and experimentally. In the modeling calculation, it is found that the threshold current of LDs with InGaN QB layers is reduced obviously, but the slope efficiency is not largely improved... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: optics