tag: ORNL

Training Large LLM Models With Billions To Trillion Parameters On ORNL’s Frontier Supercomputer
By Technical Paper Link - 16 Jan, 2024 - Comments: 0

A technical paper titled “Optimizing Distributed Training on Frontier for Large Language Models” was published by researchers at Oak Ridge National Laboratory (ORNL) and Universite Paris-Saclay. Abstract: "Large language models (LLMs) have demonstrated remarkable success as foundational models, benefiting various downstream applications through fine-tuning. Recent studies on loss scaling ... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Chip Industry Week In Review
By The SE Staff - 01 Dec, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

Technical Paper Roundup: November 21
By Liz Allan - 21 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=167 /] More Reading Technical Paper Library home » read more

High-Speed Sparse Scanning Kelvin Probe Force Microscopy
By Technical Paper Link - 14 Nov, 2023 - Comments: 0

A technical paper titled “High-speed mapping of surface charge dynamics using sparse scanning Kelvin probe force microscopy” was published by researchers at Oak Ridge National Laboratory, (ORNL), Sungkyunkwan University, Case Western Reserve University, Flinders University, Bedford Park, and UNSW Sydney. Abstract: "Unraveling local dynamic charge processes is vital for progress in diverse... » read more

Technical Paper Roundup: November 14
By Liz Allan - 14 Nov, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=165 /] More Reading Technical Paper Library home » read more

CMOS-Based HW Topology For Single-Cycle In-Memory XOR/XNOR Operations
By Technical Paper Link - 07 Nov, 2023 - Comments: 0

A technical paper titled “CMOS-based Single-Cycle In-Memory XOR/XNOR” was published by researchers at University of Tennessee, University of Virginia, and Oak Ridge National Laboratory (ORNL). Abstract: "Big data applications are on the rise, and so is the number of data centers. The ever-increasing massive data pool needs to be periodically backed up in a secure environment. Moreover, a ... » read more

Chip Industry Week In Review
By The SE Staff - 06 Oct, 2023 - Comments: 0

By Jesse Allen, Liz Allan, and Gregory Haley A potential government shutdown beginning in November would be "massively disruptive" for the Commerce Department as it continues to disburse critical funding featured in the CHIPS Act to boost semiconductor research and development in the U.S., according to Secretary Gina Raimondo. Global semiconductor industry sales totaled $44 billion in Aug... » read more

Using Deep Learning to Secure The CAN Bus From Advanced Intrusion Attacks
By Technical Paper Link - 03 Oct, 2023 - Comments: 0

A technical paper titled “CANShield: Deep Learning-Based Intrusion Detection Framework for Controller Area Networks at the Signal-Level” was published by researchers at Virginia Tech and others. "As modern vehicles become more connected to external networks, the attack surface of the CAN bus system grows drastically. To secure the CAN bus from advanced intrusion attacks, we propose a sig... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

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