tag: packaging

Taking Advantage Of Outsourced Test Services
By Vineet Pancholi - 19 Nov, 2020 - Comments: 0

The business model in today’s competitive world of commerce has shifted over recent years to “services.” Companies like Microsoft, Amazon and Google are prime success stories that have advanced the industry with business-enabling services. These economic productivity improvement services allow their customers to focus on product architecture, design and quick time to market. The service p... » read more

Bonding Issues For Multi-Chip Packages
By Katherine Derbyshire - 19 Nov, 2020 - Comments: 1

The rising cost and complexity of developing chips at the most advanced nodes is forcing many chipmakers to begin breaking up that chip into multiple parts, not all of which require leading edge nodes. The challenge is how to put those disaggregated pieces back together. When a complex system is integrated monolithically — on a single piece of silicon — the final product is a compromise ... » read more

Power Packaging Trends And The 48V Ecosystem
By Ajay Sattu - 22 Oct, 2020 - Comments: 0

With each passing year, emerging growth application areas such as automotive, cloud computing, industrial automation, and telecom (5G) infrastructure are garnering more attention. Although the application segments are different, there is a commonality in how voltage conversion and power distribution are achieved at the system level. System demands are becoming more important to reduce an effe... » read more

Packaging Demands For RF And Microwave
By Ken Molitor - 22 Oct, 2020 - Comments: 0

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

Smart Backend Assembly Factory For Industry 4.0
By Bee Bee Ng - 22 Oct, 2020 - Comments: 0

I recently spoke with Chan Pin CHONG, Executive Vice President and General Manager of Products and Solutions at Kulicke & Soffa, about how smart manufacturing is driving new production efficiencies in the semiconductor industry. During our conversation, he also provided practical steps for factory operators to follow in evaluating their smart manufacturing needs in order to ensure successfu... » read more

Side Wettable Flanks For Leadless Automotive Packaging
By Amkor - 21 Oct, 2020 - Comments: 0

The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and t... » read more

How Secure Is The Package?
By Ed Sperling - 17 Sep, 2020 - Comments: 1

Advanced packaging is a viable way of extending the benefits of Moore's Law without the excessive cost of shrinking everything to fit on a single die, but it also raises some issues about security for which there are no clear answers at the moment. OSATs and foundries have been working the kinks out of how to put the pieces together in the most cost-effective and reliable way for the better ... » read more

Early And Fine Virtual Binning
By Noam Brousard - 08 Sep, 2020 - Comments: 0

Not all chips are created equal, and this is viewed as both a blessing and a curse by semiconductor makers. On one hand, chips can be screened for certain attributes, and some of the chips can be sold for higher prices than others. On the other hand, variations in the production process cause silicon performance to greatly differ, leaving chip makers with a wide and somewhat unpredictable distr... » read more

Understanding Advanced Packaging Technologies And Their Impact On The Next Generation Of Electronics
By Sandy Wen - 28 Aug, 2020 - Comments: 2

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips. Advanced packaging has become integral to embedding increased functionality into a variety of electronics, such as cellular phones and self-driving vehicles, by supporting high device density in ... » read more

Make Acute Angles A Sharp Problem Of The Past
By Tyler Lockman - 13 Aug, 2020 - Comments: 0

Sharp angles, whether they create a spike in a poured shape or form an acid trap between two different pieces of metal, are a problem for us all. As designers, we will go out of our way to try and avoid creating these situations; they will still creep into your design despite the best of intentions. How, then, can you efficiently rid your design of them with the minimal change to your routin... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy