tag: packaging

Design Process And Methodology For Achieving High-Volume Production Quality For HDFO Packaging
By Ruben Fuentes - 16 Dec, 2021 - Comments: 0

Unlike the traditional system on chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and outsourced semiconductor assembly and test (OSAT) suppliers have typically had no integrated circuit (IC) package co-design sign-off verification process to help ensure that an IC package will meet manufacturabil... » read more

Achieving Success In Automotive Leadframe Packages
By John Nickelsen - 22 Nov, 2021 - Comments: 0

The growth of semiconductor content in automotive applications has been accelerating. This growth drives all families of semiconductor packaging in all regions. The growth is happening in the latest advanced, laminate-based packages using flip chip interconnect as well as the venerable leadframe packages using wirebond interconnect. The automotive market consumes micro-electromechanical systems... » read more

The New Technology Solutions For Advanced SiP Devices
By YongJai Seo - 18 Nov, 2021 - Comments: 0

For many years, System-in-Package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased complexity and higher package density for SiP devices has driven the development of new packaging technologies. In response, compartmental shield technology makes it possible to put several functions int... » read more

Failure Prediction Is Vital for Packaging Technology
By Sam Sadri - 18 Nov, 2021 - Comments: 0

A while back, I wrote a post on what I call the “10 Commandments of Packaging” – my list of the key things to bear in mind with respect to developing new packaging solutions. Today, packaging engineers must contend with more variables than ever, from new substrate materials to more types of packages with a greater range of complexity. With that complexity comes new challenges, and I felt ... » read more

Optimizing System-Level Connectivity In Heterogenous Automotive Packages
By Keith Felton - 04 Nov, 2021 - Comments: 0

By Keith Felton and Cristina Somma With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fi... » read more

The New Technology Solutions For Advanced SiP Devices
By YongJai Seo - 21 Oct, 2021 - Comments: 0

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased complexity and higher package density for SiP devices has driven the development of new packaging technologies. In response, compartmental shield technology makes it possible to put several functions int... » read more

How To Identify Common Electronic Failures
By Tyler Ferris - 14 Oct, 2021 - Comments: 0

Failure analysis is the process of identifying, and typically attempting to mitigate, the root cause of a failure. In the electronics industry, failure analysis involves isolating the failure to a location on a printed circuit board assembly (PCBA) before collecting more detailed data to investigate which component or board location is functioning improperly. A member of the Ansys Reliabil... » read more

STMicroelectronics Methodology And Process For Heterogeneous Automotive Package Design
By Siemens EDA - 06 Oct, 2021 - Comments: 0

As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation requires the STMicroelectronics Back-End Manufacturing Technology R&D organization to embrace the key driving forces of product development. In the automotive field, package designers need to... » read more

3D IC: Opportunities, Challenges, And Solutions
By Kenneth Larsen - 28 Sep, 2021 - Comments: 0

Nearly every big city reaches a point in its evolution when it runs out of open space and starts building vertically. This enables far more apartments, offices and people per square mile, while avoiding the increased infrastructure costs of suburban sprawl. Semiconductors are evolving in much the same way. Moore’s Law is slowing, and adoption of new advanced technology nodes is slowing as wel... » read more

Empowering RF Front End Cellular Innovations With DSMBGA
By Curtis Zwenger - 19 Aug, 2021 - Comments: 0

With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. “With our DSMBGA platform, we’ve established a preferred advanced packaging solution for this domain,”... » read more

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