Virtual Packages Improve Signal Integrity


The 112 Gb/s generation of SerDes has brought along excessive loss within the package, around 5 dBs of loss within each monolithic package. This loss markedly reduces the usefulness of these SerDes. MCM technology has progressed to where the use of 70mm packages is routine. Non-interposer MCMs easily can use 20 or more chiplets, plus large dies and passives can be used. These MCMs have low ... » read more

SerDes For Chiplets


The XSR 56G and 112G Interoperability Agreements (IAs) announced by the OIF are intended to cover a channel consisting of a pair of up to 50mm. The primary defined application of the XSR SerDes is connecting a chip to a “nearby” optical engine. Because the requirements on these channels are much less stringent than they are on long reach channels, XSR SerDes are expected to have lower power... » read more

Cloud Drives Changes In Network Chip Architectures


Cloud data centers have changed the networking topology and how data moves throughout a large data center, prompting significant changes in the architecture of the chips used to route that data and raising a whole new set of design challenges. Cloud computing has emerged as the fast growing segment of the data center market. In fact, it is expected to grow three-fold in the next few years, a... » read more

M2M’s Network Impact


Synopsys’ Manmeet Walia talks examines the impact of machine-to-machine traffic and why that requires some fundamental changes in networking architectures. Two key issues that need to be addressed are scalability and latency, which require new networking architectures. https://youtu.be/2RIQt3QVPtE » read more