Challenges At 3/2nm


David Fried, vice president of computational products at Lam Research, talks about issues at upcoming process nodes, the move to EUV lithography and nanosheet transistors, and how process variation can affect yield and device performance. » read more

Making Everything Linux-Capable


It's not clear how the edge will play out or what will be the winning formula from a hardware standpoint. But for everything beyond the end device, and possibly even including the end device, a key prerequisite will be the ability to run Linux. That means at least one processor or core within the hardware will need to run 64-bit software. In addition, systems will need to have enough storage... » read more

Getting Particular About Partitioning


Partitioning could well be one of the most important and pervasive trends since the invention of computers. It has been around for almost as long, too. The idea dates back at least as far back as the Manhattan Project during World War II, when computations were wrapped within computations. It continued from there with what we know as time-sharing, which rather crudely partitioned access by p... » read more

New Architectures, Much Faster Chips


The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

FPGA Prototyping Complexity Rising


Multi-FPGA prototyping of ASIC and SoC designs allows verification teams to achieve the highest clock rates among emulation techniques, but setting up the design for prototyping is complicated and challenging. This is where machine learning and other new approaches are beginning to help. The underlying problem is that designs are becoming so large and complex that they have to be partitioned... » read more

Re-Imagining The GPU


John Rayfield, CTO at Imagination Technologies, sat down with Semiconductor Engineering to talk about RISC-V, AI, and computing architectures. What follows are excerpts of that conversation. SE: What your plans are for RISC-V? Rayfield: We're actively finalizing the integration of RISC-V cores into future-generation GPUs. That work has been going on for several months. Moving forward, we'... » read more

Divided On System Partitioning


Building an optimal implementation of a system using a functional description has been an industry goal for a long time, but it has proven to be much more difficult than it sounds. The general idea is to take software designed to run on a processor and to improve performance using various types of alternative hardware. That performance can be specified in various ways and for specific applic... » read more

Uses And Limitations Of AI In Chip Design


Raik Brinkmann, president and CEO of OneSpin Solutions, sat down with Semiconductor Engineering to talk about AI changes and challenges, new opportunities for using existing technology to improve AI, and vice versa. What follows are excerpts of that conversation. SE: What's changing in AI? Brinkmann: There are a couple of big changes underway. One involves AI in functional safety, where y... » read more

Scaling, Packaging, And Partitioning


Prior to the finFET era, most chipmakers either focused on shrinking or packaging, but they rarely did both. Going forward, the two will be inseparable, and that will lead to big challenges with partitioning of data and processing. The key driver here, of course, is that device scaling no longer provides appreciable benefits in power, performance and cost. Nevertheless, scaling does provide ... » read more

Addressing Pain Points In Chip Design


Semiconductor Engineering sat down to discuss the impact of multi-physics and new market applications on chip design with John Lee, general manager and vice president of ANSYS' Semiconductor Business Unit; Simon Burke, distinguished engineer at Xilinx, Duane Boning, professor of electrical engineering and computer science at MIT; and Thomas Harms, director EDA/IP Alliance at Infineon. What foll... » read more

← Older posts Newer posts →