Speeding Time-To-Market With A Comprehensive And Tightly Integrated Design And Verification Process

By Siemens EDA - 06 Sep, 2023 - Comments: 0

Nobo Automotive Technology Co., Ltd. is a high-tech automotive electronics company under the Nobo Automotive group, focusing on intelligent cockpit, vehicle control, connectivity, and driving. Its range of products include cabin domain controllers, displays, instrument clusters, infotainment systems, central electronic units, T-Box terminals, and driving domain controllers, among others. Nobo A... » read more

PCB Design From Start To Finish: E-Book

By Cadence - 02 Nov, 2022 - Comments: 0

This ebook by John Burkhert is a step-by-step guide on printed circuit board design with information suitable for beginners to graduate-level users. This series is for anyone who wants to design their own printed circuit boards or perform designs for others. While an electronics degree is not required, beginners would do well to consider basic electronic theory as a prerequisite. Each ... » read more

Data Management Position: An Automated Approach to Intelligent PCB Design Data Management

By Cadence - 04 May, 2022 - Comments: 0

The design cycle of electronic devices produces vast amounts of data. From a top-level view, this data can be broken down into basic blocks, including software, circuit board design, mechanical design, and others. These blocks contain extensive and complex information, including the types and amounts of individual data and information files, as well as their hierarchy structure. This data and i... » read more

Optimize Designs And Mitigate Thermal Threats In High-Current Automotive Applications

By Cadence - 23 Mar, 2022 - Comments: 0

By Melika Roshandell, Cadence Design overview Current density increases at the PCB/package level result in local temperature increases known as hotspots. In addition to highlighting the heat generated locally around and underneath certain components at the PCB or IC package level due to component power consumption, the Celsius Thermal Solver can calculate the heat generated by the Joule ef... » read more

Fast And Simple Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver

By Cadence - 06 Oct, 2021 - Comments: 0

3D PCB Electromagnetic (EM) Bending Analysis Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and F... » read more

Optimizing Power Supply

By Cadence - 10 Feb, 2021 - Comments: 0

Any electrical engineer knows providing power to your board is a key feature in PCB design. While most boards can be functional, their true quality shines when the perfect level of power to components is achieved. Building and designing better power supplies is the best way to ensure the end-product has full life-cycle potential. But how do we ensure we can convert a (potentially variable) i... » read more

Rigid-Flex PCB Bending EM Analysis Using Clarity 3D Solver

By Cadence - 28 Oct, 2020 - Comments: 0

Rigid-Flex PCBs have been used in many modern electronic devices (such as mobile phones, laptops, and wearables, among others), due to their form factor, light weight, and cost-effectiveness. Electromagnetic (EM) analysis of Rigid-Flex PCBs has always been a challenging task for many commercially available 3D numerical solver technologies (FEM and FDTD), due to the complexity in the 3D designs.... » read more

3D PCB Design And Analysis: ECAD/MCAD And Where They Converge

By Cadence - 07 Oct, 2020 - Comments: 0

The design of a board and its ‘home’ are heavily interdependent. They require careful consideration to ensure everything will be in working order when your product is ultimately brought to market. Many designs have been derailed by conflicts between ECAD and MCAD. Something as simple as an improperly placed / communicated mounting hole can send your project into a tailspin of re-designs. ... » read more

Driving Intelligence To The IoT Edge Invents A New Breed Of Designers

By Mentor, a Siemens Business - 02 Nov, 2016 - Comments: 0

A new breed of designers has arrived that is leveraging inexpensive sensors to build the intelligent systems at the edge of the Internet of Things (IoT). These systems play in every space: from devices on the body, vehicles, the workplace, across the land, sea, air, and the outer reaches of space. It’s no surprise that this new breed of designers is taking full advantage of advanced sensing t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?