tag: PCBs

Power/Performance Bits: Feb. 4
By Jesse Allen - 04 Feb, 2020 - Comments: 0

Infrared nanoantenna Researchers at the University of Würzburg built a nanoantenna capable of generating directed infrared light. The Yagi-Uda antenna is the smallest of its type yet created. "Basically, it works in the same way as its big brothers for radio waves ," said René Kullock, a member of the nano-optics team at Würzburg. An AC voltage is applied that causes electrons in the met... » read more

Putting “Design” Back Into Design For Test In PCB Products
By Mentor, a Siemens Business - 11 Jun, 2018 - Comments: 0

Design for manufacturing (DFM) has become a proactive part of the design process, but the same cannot be said for DFT. Whereas “left-shifting” DFM has reduced manufacturing problems, increased yield, reduced scrap levels, and simplified engineering rework, testability-related improvements have stayed flat during that same time. Unfortunately, as assembly costs have come down, and test-relat... » read more

EDA, IP Sales Up 8%
By Ed Sperling - 15 Jan, 2018 - Comments: 0

The EDA sector continues to exhibit solid growth, increasing 8% to $2.2262 billion in Q3, up from $2.0937 billion in the same period in 2016, according to the most recent stats from the ESD Alliance Market Statistics Service. The four-quarter moving average was up 11.5%, year over year. While all of the numbers were up, two areas showed extraordinary growth. One involved Japan, which showed ... » read more

Get Ready For In-Mold Electronics
By Jeff Dorsch - 11 Sep, 2017 - Comments: 1

Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That's the promise of in-mold electronics (IME), a technology that has been around for years, but which is just beginning to see wider adoption. The technology is related to conductive inks and transparent conductive films. The IME manufacturing process is said to pr... » read more

Inside Panel-Level Fan-Out Technology
By Mark LaPedus - 11 Sep, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss panel-level fan-out packaging technology with Tanja Braun, deputy group manager at the Fraunhofer Institute for Reliability and Microintegration IZM, and Michael Töpper, business development manager at Fraunhofer IZM. Braun is responsible for the Panel Level Packaging Consortium at Fraunhofer IZM, as well as the group manager for assembly and encap... » read more

Industry 4.0 And The Internet Of Manufacturing For PCB Assembly & Fabrication
By Michael Ford - 27 Oct, 2016 - Comments: 0

For years, the PCB manufacturing industry has needed a robust real-time, comprehensive shop-floor communication standard that would include detailed, bidirectional, machine-to-machine communication, as well as shop-floor to IT computerization communication. Now, there is a solution: the Open Manufacturing Language (OML), an open communications specification managed through a community of indust... » read more

Advanced Analog And Mixed Signal Design Continues Pushing The Design Envelope
By Paul Musto - 28 Jul, 2016 - Comments: 0

As PCB design has evolved into its present form with extremely complex boards housing high speed circuitry in very small areas, analog and mixed signal (AMS) and high speed analysis can address the latest design challenges. Analog/mixed signal design More and more products incorporate more than just digital circuitry. The vast majority of products now integrate digital and analog circuitr... » read more

Automating Inter-Layer In-Design Checks In Rigid-Flex PCBs
By Cadence - 27 Jul, 2016 - Comments: 0

Flexible PCBs (flex/rigid-flex) make it possible to create a variety of products that require small form factors and light weight, such as wearable, mobile, military, and medical devices. As flexible PCB fabrication technology has matured in response to demands for smaller, lighter products, new design challenges have emerged. This paper discusses some of the key challenges to address and also ... » read more

Bridging the IP Divide
By Brian Bailey - 18 May, 2016 - Comments: 1

IP reuse enabled greater efficiency in the creation of large, complex SoCs, but even after 20 years there are few tools to bridge the divide between the IP provider and the IP user. The problem is that there is an implicit fuzzy contract describing how the IP should be used, what capabilities it provides, and the extent of the verification that has been performed. IP vendors have been trying to... » read more

Thermal Damage To Chips Widens
By Ed Sperling - 11 Feb, 2016 - Comments: 1

Heat is becoming a much bigger problem for semiconductor and system design, fueled by higher density and the increasing use of complex chips in markets such as automotive, where reliability is measured in decade-long increments. In the past, heat typically was handled by mechanical engineers, who figured out where to put heat sinks, fans, or holes to funnel heat out of a chassis. But as more... » read more

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