tag: Pennsylvania State University

Chip Industry’s Technical Paper Roundup: Apr. 25
By Linda Christensen - 25 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=94 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Spiking Neural Networks: Hardware & Algorithm Developments
By Technical Paper Link - 18 Apr, 2023 - Comments: 0

A new technical paper titled "Exploring Neuromorphic Computing Based on Spiking Neural Networks: Algorithms to Hardware" was published by researchers at Purdue University, Pennsylvania State University, and Yale University. Excerpt from Abstract: "In this article, we outline several strides that neuromorphic computing based on spiking neural networks (SNNs) has taken over the recent past, a... » read more

Research Bits: Jan. 24
By Jesse Allen - 24 Jan, 2023 - Comments: 0

Transistor-free compute-in-memory Researchers from the University of Pennsylvania, Sandia National Laboratories, and Brookhaven National Laboratory propose a transistor-free compute-in-memory (CIM) architecture to overcome memory bottlenecks and reduce power consumption in AI workloads. "Even when used in a compute-in-memory architecture, transistors compromise the access time of data," sai... » read more

Research Bits: Jan. 9
By Jesse Allen - 09 Jan, 2023 - Comments: 0

Making stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Purdue University, and Texas Heart Institute developed a new method to make soft, stretchable transistors easier and cheaper to manufacture. The lateral phase separation induced micromesh (LPSM) process involves mixing a semiconductor and an elastomer and spin coating the liquid mixture pre... » read more

Hardware Encryption: Ultra-compact Active Interconnect Based on FeFET
By Technical Paper Link - 02 May, 2022 - Comments: 0

New technical paper "Hardware functional obfuscation with ferroelectric active interconnects" from researchers at Penn State, Rochester Institute of Technology, GlobalFoundries Fab1, North Dakota State University. Abstract "Existing circuit camouflaging techniques to prevent reverse engineering increase circuit-complexity with significant area, energy, and delay penalty. In this paper, we... » read more

Academic Research Paper Round-Up: April 13
By Linda Christensen - 13 Apr, 2022 - Comments: 0

The volume of research into advanced semiconductors is rising and widening. The latest batch includes hybrid power-gating architecture, RRAM devices models, improved FMEA, quantum machine learning, enhanced nonlinear optics, harvesting energy after sundown, direct chemisorption-assisted nanotransfer printing, and more. Topping the list of researchers this week are ETH Zurich, Stanford Unive... » read more

Quantum Machine Learning: Security Threats & Lines Of Defense
By Technical Paper Link - 12 Apr, 2022 - Comments: 0

New research paper from Pennsylvania State University explores quantum machine learning (QML) and its use in hardware security. Find the technical paper here. April 2022. Satwik Kundu and Swaroop Ghosh. 2022. Security Aspects of Quantum Machine Learning: Opportunities, Threats and Defenses (Invited). In Proceedings of the Great Lakes Symposium on VLSI 2022 (GLSVLSI ’22), June 6–8,... » read more

Microstructural impacts on ionic conductivity of oxide solid electrolytes from a combined atomistic-mesoscale approach
By Technical Paper Link - 04 Apr, 2022 - Comments: 0

Academic paper from Lawrence Livermore National Laboratory (LLNL) scientists in collaboration with San Francisco State University and the The Pennsylvania State University. Abstract "Although multiple oxide-based solid electrolyte materials with intrinsically high ionic conductivities have emerged, practical processing and synthesis routes introduce grain boundaries and other interfaces t... » read more

Research Bits: March 29
By Jesse Allen - 29 Mar, 2022 - Comments: 0

Brain-like AI chip Researchers from Purdue University, Santa Clara University, Portland State University, Pennsylvania State University, Argonne National Laboratory, University of Illinois Chicago, Brookhaven National Laboratory, and University of Georgia built a reprogrammable chip that could be used as the basis for brain-like AI hardware. “The brains of living beings can continuously l... » read more

Power/Performance Bits: Jan. 25
By Jesse Allen - 25 Jan, 2022 - Comments: 0

Nanoscale 3D optics Researchers at Rice University and University of Houston are using 3D printing to build nanostructures of silica for micro-scale electronic, mechanical, and photonic devices. “It’s very tough to make complicated, three-dimensional geometries with traditional photolithography techniques,” said Jun Lou, a professor of materials science and nanoengineering at Rice. �... » read more

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