Is EUV Making Progress?

By Ann Mutschler - 18 Jun, 2015 - Comments: 4

By Ann Steffora Mutschler & Ed Sperling EUV has been promised for a couple of decades, counted on for at least three process nodes on the ITRS roadmap, and considered essential to chip manufacturing since 22nm. Billions of dollars have been invested in R&D, engineering teams from around the world have contributed to its development, and still serious problems persist. Just how close... » read more

Manufacturing Bits: Sept. 3

By Mark LaPedus - 03 Sep, 2013 - Comments: 0

Dancing With The Stars In telescopes, the ability to see distant stars and galaxies is driven by the light-gathering area and detectors in the system. In the last 50 years, the collecting area in large-scale telescopes has increased by only a factor of four, according to researchers from the University of California at Santa Barbara. Meanwhile, the sensitivity of CCD detectors has increased... » read more

EUV Remains Elusive

By Ed Sperling - 31 Jul, 2012 - Comments: 0

By David Lammers Intel’s decision to invest as much as $4.1 billion in ASML has raised overall confidence levels in EUV lithography, and should allow the Dutch lithography vendor to funnel more funds into the stubbornly difficult effort to raise the EUV source power. ASML has said it needs to reach 250 Watts of average source power to achieve the 125 wph throughputs sought by its early cu... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: photoresist

Is EUV Making Progress?

Manufacturing Bits: Sept. 3

EUV Remains Elusive