Demand Picks Up For 200mm


Demand is growing for both 200mm fab capacity and equipment, setting the stage for possible shortages in coming months. But there are also some uncertainties, if not warning signs, in the 200mm market and the entire IC industry. Trade disputes, as well as the current coronavirus outbreak in China, likely will impact the chip and equipment markets. The size of the impact and the duration rema... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Better PMIC Design Using Multi-Physics Simulation


Energy efficiency and thermal management are gaining importance in the IC and system design community. Because the integrated circuit is the major source of power consumption and hence heat dissipation, semiconductor companies are under immense pressure to reduce the overall power envelope of the IC that goes into the system. This phenomenon is seen globally, irrespective of whether the chip... » read more