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Calibrate And Configure Your Power Management IC With NVM IP


Power Management Integrated Circuits (PMICs) are the first to turn on and the last to turn off in a system. They perform the task of delivering the right voltage to component chips by regulating or boosting the voltage levels to the component chips. Some PMICs are configured once at the factory and an area-efficient OTP NVM is the best choice. When a PMIC is expected to be re-configured mult... » read more

End In Sight For Chip Shortages?


The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

Chip Shortages Grow For Mature Nodes


The current wave of chip shortages is expected to last for the foreseeable future, particularly for a growing list of critical devices produced in mature process nodes. Chips manufactured at mature nodes typically fall under the radar, but they are used in nearly every electronic device, including appliances, cars, computers, displays, industrial equipment, smartphones, and TVs. Many of thes... » read more

Demand Picks Up For 200mm


Demand is growing for both 200mm fab capacity and equipment, setting the stage for possible shortages in coming months. But there are also some uncertainties, if not warning signs, in the 200mm market and the entire IC industry. Trade disputes, as well as the current coronavirus outbreak in China, likely will impact the chip and equipment markets. The size of the impact and the duration rema... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Better PMIC Design Using Multi-Physics Simulation


Energy efficiency and thermal management are gaining importance in the IC and system design community. Because the integrated circuit is the major source of power consumption and hence heat dissipation, semiconductor companies are under immense pressure to reduce the overall power envelope of the IC that goes into the system. This phenomenon is seen globally, irrespective of whether the chip... » read more