tag: Promex Industries

SiPs And MCMs Broaden Opportunities For Military-Aerospace System Design
By Rosie Medina - 23 May, 2022 - Comments: 0

Military and aerospace (mil-aero) applications, from satellites and rockets to ships and planes, increasingly require electronic systems and subsystems with high functionality and performance in a small form factor. Meeting these demands poses higher-level challenges for packaging of these microelectronic devices, which needs to be rugged, long-lived, and affordable. Usage of multi-chip modu... » read more

Wafer Shortage Improvement In Sight For 300mm, But Not 200mm
By Adele Hars - 19 May, 2022 - Comments: 2

The supply chain for bare wafers is off-kilter. Demand is appreciably higher than the wafer suppliers can keep up with, creating shortages that could last for years. For 300mm starting wafers, the top five big players — SEH and Sumco of Japan, Siltronic of Germany, GlobalWafers of Taiwan, and SK Siltron of Korea — finally took action over the last year, spending billions on new wafer fac... » read more

Durability And Cost Benefits Drive Mil-Aero Demand For OCPP
By QP Technologies - 20 Apr, 2022 - Comments: 0

Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They are able to withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t o... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Mar, 2022 - Comments: 0

Chipmakers and OEMs Apple has rolled out its most powerful processor, dubbed the M1 Ultra, a multi-die chip that incorporates the company's new packaging technology. The M1 Ultra is incorporated in Apple’s new Mac Studio desktop. M1 Ultra features a 20-core CPU, a 64-core GPU, and a 32-core Neural Engine. The M1 Ultra also features UltraFusion, Apple’s new packaging architecture. M1 Ult... » read more

Technology Advances, Shortages Seen For Wire Bonders
By Mark LaPedus - 17 Feb, 2022 - Comments: 2

A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

2021 Top Tech Videos
By Linda Christensen - 28 Dec, 2021 - Comments: 0

While the world’s chip shortage dominated the 2021 headlines, the semiconductor industry blazed new trails with the increased electrification of cars, focused AI applications, improving power/performance, better utilization of data deluges, dealing with design challenges in advanced nodes and much more focus on chip security. Semiconductor Engineering’s Tech Talks reflected these focus a... » read more

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

Scaling Bump Pitches In Advanced Packaging
By Mark LaPedus - 25 Oct, 2021 - Comments: 0

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Oct, 2021 - Comments: 0

Market research For some time, the semiconductor industry has experienced acute shortages. The automotive industry has suffered the most. When will this all end? “Shortages have become more acute for many products in the near term because the growth in demand is greater than the increase in wafer and packaging capacity that was anticipated by the foundry and semiconductor vendors. To date... » read more

Open Cavity Plastic Packaging
By Ed Sperling - 30 Sep, 2021 - Comments: 0

Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly Quik-Pak), talks with Semiconductor Engineering about why it’s so important to use existing package footprints, what are the challenges in replacing the circuitry inside a package, and which markets a... » read more

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