tag: proteanTecs

Early And Fine Virtual Binning
By Noam Brousard - 08 Sep, 2020 - Comments: 0

Not all chips are created equal, and this is viewed as both a blessing and a curse by semiconductor makers. On one hand, chips can be screened for certain attributes, and some of the chips can be sold for higher prices than others. On the other hand, variations in the production process cause silicon performance to greatly differ, leaving chip makers with a wide and somewhat unpredictable distr... » read more

Startup Funding: August 2020
By Jesse Allen - 02 Sep, 2020 - Comments: 0

Semiconductor startups were hot this month, with big funding going to designers and chip analytics. In automotive, one Chinese electric vehicle company raised another large round right before its IPO, and a LiDar maker's reverse merger gave it a cash infusion and set it on its own IPO road. Plus, a growing quantum computer developer saw a funding boost. This month, we feature 17 startups that c... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Aug, 2020 - Comments: 0

Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Marvell is working on silicon for the data infrastructure market using TSMC’s 5nm process node. Marvell says it has multiple designs already under contract for its 5nm portfolio across the carrier, enterprise, automotive, and data center markets. The first products are sampling by the end of next year.  Ansys’ multiphysics signoff tools, R... » read more

Chiplet Reliability Challenges Ahead
By Ed Sperling - 12 Aug, 2020 - Comments: 2

Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

Fleet Management Of Data Center Electronics
By Yuval Bonen - 11 Aug, 2020 - Comments: 0

Data has become the most valuable resource of our time, with processing, storage and networking being the key assets of the modern digital world. This has fueled a two-decade spread of massive data centers around the globe and a surge in the cloud services they offer people, corporations, and countries alike. New services like video, game streaming, AI and social media push the need for data... » read more

Auto Chip Reliability Opens Door To Other Industries
By Susan Rambo - 11 Aug, 2020 - Comments: 1

Digital chips in the semiconductor industry evolve from each other. Ideas flow into each other over the years, with occasional big leaps in evolution. The term ‘evolution’ fits because one chip evolves to perfectly optimized for one industry niche. But what happens when one industry’s chip becomes a useful for other industries because it is more cost-effective than what is being used i... » read more

In-field In-Mission Reliability Monitoring Based On Deep Data
By proteanTecs - 11 Aug, 2020 - Comments: 0

This paper describes a Deep Data approach to reliability monitoring in advanced electronics, based on degradation as a precursor for failure. By applying machine learning algorithms and analytics to data created by on-chip monitoring IPs (Agents), IC/system health and performance can be continuously monitored, at all stages of the product lifecycle. Realtime degradation analysis of critical par... » read more

No Two Chips Are Alike
By Alex Burlak - 27 Jul, 2020 - Comments: 0

As semiconductor processes continue to shrink it’s becoming increasingly challenging to manage the parameters of individual devices not only across the diameter of the wafer, but also across the length of a single chip, especially for a complex chip with a large area. Today’s standard approach to this problem is to assume the worst case and to create a sub-optimal design that accommodates t... » read more

Navigating Timing Margins Like Waze
By Noam Brousard - 13 Jul, 2020 - Comments: 0

Remember the pre-smartphone days, before navigation apps had our backs? Thanks to a lack of real-time visibility, ‘arriving early’ was the go-to strategy to avoid arriving late. Factor in too much ‘holdup time’ and you’d arrive a little too early. There’s nothing worse than nervously burning off an excess 30 minutes over a coffee you really didn’t need. Today you wouldn’t ... » read more

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