Adding Safety Into Automotive Design

By Ann Mutschler - 04 Oct, 2018 - Comments: 0

The ISO 26262 spec is a household term for anyone even remotely involved with the automotive industry today. Increasingly, though, it is being used interchangeably with safety-readiness across the entire supply chain. ISO 26262 compliance is a prerequisite for IP and chips used in an increasing number of automotive applications. It applies to systems, software, and to individual products. An... » read more

The Value of Runtime Knowledge Management

By Applied Materials - 20 Sep, 2018 - Comments: 0

In clinical and commercial manufacturing when measures are taken to prevent deviations, the findings aren’t often shared across the enterprise and when corrective actions are taken to resolve an issue, they often don’t address the actual root cause(s). The Applied SmartFactory® Rx™ Knowledge Management solution allows knowledge captured in the R&D and design phases to be used th... » read more

Cracking The Auto IC Market

By Ann Mutschler - 06 Sep, 2018 - Comments: 0

The market for automotive electronics is booming, and it has set off a global scramble among established chipmakers and startups. What's becoming clear, though, is that not everyone understands just how different automotive is from the mobile market. Mobile is still the highest-volume market for semiconductors, but the growth has flattened. In contrast, the value of the automotive electronic... » read more

Defect Reduction At 7/5nm

By Ed Sperling - 12 Jul, 2018 - Comments: 0

Darin Collins, director of metrology at Brewer Science, talks about the cause of defects at advanced nodes and how material purity increasingly plays a role in overall quality and yield. » read more

Chipping Away At Functional Safety Flaws In Automotive Electronics

By Ansys - 11 Apr, 2018 - Comments: 0

Today’s automobiles are packed with electronics. From autonomous driving support and infotainment systems to mission-critical functions like braking, a car’s performance depends on the reliability of these electronics systems. While the semiconductors that lie at the heart of these systems have been not been a focus in the past, today their reliability is coming under closer scrutiny by bot... » read more

Smaller, Faster, Cheaper—But Different

By Ed Sperling - 22 Mar, 2018 - Comments: 0

The old mantra of "smaller, faster, cheaper" has migrated from the chip level to the electronic system level, raising some interesting questions about where the real value is being generated. Smaller as it pertains to gate size, line widths and spaces, will continue in an almost straight line for at least the next decade. The ability to print three-dimensional features on a nanoscale using E... » read more

Tech Talk: Automotive Design

By Ann Mutschler - 22 Mar, 2018 - Comments: 0

NetSpeed Systems CEO Sundari Mitra talks about how to speed up the design of automotive chips. https://youtu.be/cus4fStDa5c » read more

Is Advanced Packaging The Next SoC?

By Ed Sperling - 05 Mar, 2018 - Comments: 1

Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

Finding Faulty Auto Chips

By Mark LaPedus - 05 Mar, 2018 - Comments: 1

The next wave of automotive chips for assisted and autonomous driving is fueling the development of new approaches in a critical field called outlier detection. KLA-Tencor, Optimal+, as well as Mentor, a Siemens Business, and others are entering or expanding their efforts in the outlier detection market or related fields. Used in various industries for several years, outlier detection is one... » read more

Looking At Test Differently

By Ed Sperling - 05 Mar, 2018 - Comments: 1

Wilhelm Radermacher, executive advisor at [getentity id="22816" e_name="Advantest"], sat down with Semiconductor Engineering to discuss how the impact of rapid market changes, advanced packaging approaches and increasing complexity on test strategies and equipment. What follows are excerpts of that conversation. SE: As we move into new markets where use models and stresses on devices are dif... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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