Connecting The Car

By Ed Sperling - 22 Jun, 2017 - Comments: 0

K. Charles Janac, chairman and CEO of ArterisIP, sat down with Semiconductor Engineering to discuss changes in automotive and how the connected car will affect chip design and a multitude of other markets. What follows are excerpts of that conversation. SE: What is the biggest change you're seeing in semiconductors? Janac: The really big change is that mobility is flattening out. The mark... » read more

The LiDAR Gold Rush

By Jeff Dorsch - 12 Jun, 2017 - Comments: 0

Big money is pouring into the LiDAR market, as carmakers gear up for autonomous and assisted driving. LiDAR, along with advanced computer vision and radar sensors, is an essential component for vehicles to maneuver without hitting obstacles or other cars. LiDAR is an acronym for light imaging, detection, and ranging, and until now it has been almost synonymous with next-generation automotive... » read more

LiDAR Completes Sensing Triumvirate

By Jeff Dorsch - 06 Apr, 2017 - Comments: 3

Fully autonomous vehicles of the future will depend on a combination of different sensing technologies – advanced vision systems, radar, and light imaging, detection, and ranging (LiDAR). Of the three, LiDAR is now the costliest part of that equation, and there are worldwide efforts to bring down those costs. Mechanical LiDAR units are currently available, priced in the hundreds of dollars... » read more

Antenna Design Grows Up

By Ann Mutschler - 09 Mar, 2017 - Comments: 2

Apple’s iPhone 4 antenna issue represents a classic example of what can go wrong in modern antenna design. Put one in the wrong place, and a seemingly insignificant part can turn a cool new product into a public relations nightmare. Ever since antennas dropped out of sight, most consumers don't give them a second thought. In the 1960s, almost every home had a rooftop antenna. Fast forward ... » read more

What’s New In Connected Autos

By Jeff Dorsch - 02 Feb, 2017 - Comments: 0

Connected cars and the Internet of Things go together like peanut butter and jelly. But realizing the future of autonomous vehicles will demand close attention to be paid to cybersecurity, functional-safety standards, and other critical factors. [getkc id="76" kc_name="IoT"] will advance the era of self-driving cars, which currently is dominated by Tesla Motors. At the same time, it will cha... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 19 Dec, 2014 - Comments: 0

This announcement could send some shock waves throughout the foundry business. For its baseband chips, Qualcomm uses several foundries, namely GlobalFoundries, Samsung and TSMC. Now, Qualcomm has another foundry partner. China’s Semiconductor Manufacturing International Corp. (SMIC) says that it has fabricated Qualcomm’s 28nm Snapdragon 410 processors. Snapdragon 410 is a processor that int... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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