Materials And Technologies For High Temperature, Resilient Electronics


A technical paper titled “Materials for High Temperature Digital Electronics” was published by researchers at University of Pennsylvania, Air Force Research Laboratory, and Ozark Integrated Circuits. Abstract: "Silicon microelectronics, consisting of complementary metal oxide semiconductor (CMOS) technology, have changed nearly all aspects of human life from communication to transportatio... » read more

Selective Radiation Mitigation For Integrated Circuits


Shortened lifecycles and cost reduction coupled with the demand for advanced capabilities continue to challenge project teams delivering IC into space systems. To meet these demands, project teams must continue to evolve across all aspects of the lifecycle, including the implementation and verification of mitigation protections against single event effects. This paper defines a methodology t... » read more

GaN Power Devices: Stability, Reliability and Robustness Issues


A technical paper titled "Stability, Reliability, and Robustness of GaN Power Devices: A Review" was published by researchers at Virginia Polytechnic Institute and State University, Johns Hopkins University Applied Physics Laboratory, and Kyushu University. "Gallium nitride (GaN) devices are revolutionarily advancing the efficiency, frequency, and form factor of power electronics. However, t... » read more

Radiation-Hardened Non-Volatile Magnetic Latch That Tolerates SNUs and DNUs


A research paper titled "A Radiation-Hardened Non-Volatile Magnetic Latch with High Reliability and Persistent Storage" was published by researchers at Anhui University, Hefei University of Technology, LIRMM, and Kyutech. According to the abstract: "Based on an advanced triple-path dual-interlocked-storage-cell (TPDICE) and MTJs, this paper proposes a radiation-hardened non-volatile magneti... » read more

Effects of Size Scaling and Device Architecture on the Radiation Response of Nanoscale MOS Transistors


A new technical paper titled "Perspective on radiation effects in nanoscale metal–oxide–semiconductor devices" was published by a researcher at Vanderbilt University, Nashville, Tennessee. The work was partially supported by the Defense Threat Reduction Agency and by the U.S. Air Force Office of Scientific Research and Air Force Research Laboratory. According to the paper, "this Perspect... » read more

Novel Family of Semiconductors


New research paper titled "Semiconducting silicon–phosphorus frameworks for caging exotic polycations" from researchers at Department of Chemistry, Iowa State University, and Ames Laboratory, U.S. Department of Energy. Abstract "A series of novel semiconductors AAe6Si12P20X (A = Na, K, Rb, Cs; Ae = Sr, Ba; X = Cl, Br, I) is reported. Their crystal structures feature a tetrahedral Si–P f... » read more

Efficacy of Transistor Interleaving in DICE Flip-Flops at a 22 nm FD SOI Technology Node


New research paper from University of Saskatchewan, with funding by NSERC and the Cisco University Research Program. Abstract "Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single event upsets than comparable bulk technologies, but upsets are still likely to occur at nano-scale feature sizes, and additional hardening techniques should be explor... » read more

FLODAM: Cross-Layer Reliability Analysis Flow for Complex Hardware Designs


Abstract "Modern technologies make hardware designs more and more sensitive to radiation particles and related faults. As a result, analysing the behavior of a system under radiation-induced faults has become an essential part of the system design process. Existing approaches either focus on analysing the radiation impact at the lower hardware design layers, without further propagating any rad... » read more

RT Kintex UltraScale FPGAs For Ultra High Throughput And High Bandwidth Applications


Xilinx's UltraScale architecture extends FPGA capability for space applications, delivering a step-function increase in I/O and memory bandwidth, capacity, performance, and in-orbit re-configurability. For the first time, the RT Kintex UltraScale XQRKU060 FPGA enables the satellite industry to access ultra-high throughput on-board processing of hundreds of Gb/s. This capability allows spacecraf... » read more

Far Out AI In Remote Locations


There really isn’t anything that you can do on Earth with electronics that you can’t do in space, but it certainly can be a lot harder and take longer to fix is something goes wrong. And as more intelligent electronics are launched into space, the concern over potential failures is growing. AI inferencing has been pushing out further for some time, and it is starting to redefine what con... » read more

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