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Novel Family of Semiconductors


New research paper titled "Semiconducting silicon–phosphorus frameworks for caging exotic polycations" from researchers at Department of Chemistry, Iowa State University, and Ames Laboratory, U.S. Department of Energy. Abstract "A series of novel semiconductors AAe6Si12P20X (A = Na, K, Rb, Cs; Ae = Sr, Ba; X = Cl, Br, I) is reported. Their crystal structures feature a tetrahedral Si–P f... » read more

Efficacy of Transistor Interleaving in DICE Flip-Flops at a 22 nm FD SOI Technology Node


New research paper from University of Saskatchewan, with funding by NSERC and the Cisco University Research Program. Abstract "Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single event upsets than comparable bulk technologies, but upsets are still likely to occur at nano-scale feature sizes, and additional hardening techniques should be explor... » read more

FLODAM: Cross-Layer Reliability Analysis Flow for Complex Hardware Designs


Abstract "Modern technologies make hardware designs more and more sensitive to radiation particles and related faults. As a result, analysing the behavior of a system under radiation-induced faults has become an essential part of the system design process. Existing approaches either focus on analysing the radiation impact at the lower hardware design layers, without further propagating any rad... » read more

RT Kintex UltraScale FPGAs For Ultra High Throughput And High Bandwidth Applications


Xilinx's UltraScale architecture extends FPGA capability for space applications, delivering a step-function increase in I/O and memory bandwidth, capacity, performance, and in-orbit re-configurability. For the first time, the RT Kintex UltraScale XQRKU060 FPGA enables the satellite industry to access ultra-high throughput on-board processing of hundreds of Gb/s. This capability allows spacecraf... » read more

Far Out AI In Remote Locations


There really isn’t anything that you can do on Earth with electronics that you can’t do in space, but it certainly can be a lot harder and take longer to fix is something goes wrong. And as more intelligent electronics are launched into space, the concern over potential failures is growing. AI inferencing has been pushing out further for some time, and it is starting to redefine what con... » read more

Mitigating The Effects Of Radiation On Advanced Automotive ICs


The safety considerations in an automotive IC application have similarities to what is seen in other safety critical industries, such as the avionics, space, and industrial sectors. ISO 26262 is the state-of-the-art safety standard guiding the safety activities and work products required for electronics deployed in an automotive system. ISO 26262 requires that a design be protected from the eff... » read more

Power, Reliability And Security In Packaging


Semiconductor Engineering sat down to discuss advanced packaging with Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; and Tien Shiah, senior manager for memory at Samsun... » read more