tag: Rambus

Tougher Memory Choices
By Brian Bailey - 12 Jun, 2014 - Comments: 1

Memories have become a hot topic, so Semiconductor Engineering sat down with experts during DAC to discuss some of the issues. Taking part in the conversation were Herbert Gebhart vice president of interface and system solutions in the Memory and Interfaces Division of Rambus, Bernard Murphy, chief technology officer for Atrenta; Patrick Soheili, vice president and general manager for IP Soluti... » read more

What’s Wrong With Power Signoff
By Ed Sperling - 12 Jun, 2014 - Comments: 0

Reducing power has emerged as the most pressing issue in the history of technology. On one hand, it’s the biggest opportunity the electronics industry has ever seen. On the other, the abuse of cheap power has been linked to global warming, human catastrophe, and geopolitical strife. In all cases, the semiconductor increasingly finds itself at the vortex of all of this, and making chips more e... » read more

M2M And The Internet Of Things
By Ernest Worthman - 05 Jun, 2014 - Comments: 1

Securing the Internet of Things/Everything (IoT/E) is a bit like herding cats. There are so many elements that will make up the IoT/E, it may seem an insurmountable objective to corral them all into a single stable. By some accounts, we’re on our way toward 200 billion Internet-connected machines by 2020, according to IDC. Soon we will live in a world where automated machine-to-machine (M2M) ... » read more

Mobile Device Security
By Rambus - 05 Jun, 2014 - Comments: 0

As the functionality of mobile devices has increased, so have the threats. These devices make attractive targets, given the sensitivity of user and corporate data they process and store, their emerging use for viewing protected content and conducting sensitive banking and payment transactions. Until recently, hardware and software based defenses for mobile platforms lagged behind those found in... » read more

Blog Review: June 4
By Ed Sperling - 04 Jun, 2014 - Comments: 0

Sonics' Drew Wingard looks at the challenges of IP integration, from standards to re-use to the need for intelligence on the network. Given the focus on IP integration, as well as the myriad challenges, this is very timely information. ARM's Karthik Ranjan has an interesting theory about why Java developers wear glasses. Ansys' Justin Nescott unearths the five most interesting engineering... » read more

The Week In Review: Design
By Ed Sperling - 16 May, 2014 - Comments: 0

M&A Synopsys’ Coverity subsidiary bought Kalistick, a French company that makes cloud-based solutions to boost testing efficiency by allowing engineers to identify and prioritize tests. Terms of the deal were not disclosed. Tools Cadence rolled out verification IP for the new PCI Express 4.0 architecture. The new spec supports up to 16 billion transactions per second, which is double... » read more

Memory Matters For Mid-Range Mobile Devices
By Ajay Jain - 09 May, 2014 - Comments: 2

In recent months, we’ve seen signs of saturation in the high-end mobile device market where smartphones and tablets retail for more than $300. The largest growth in the mobile device markets are in Asia, with China in particular showing an annual growth rate of more than 50% in the mid-range ($100-$299) market while low-end products retail for less than $50! Features like storage capacity,... » read more

Pointing Fingers, Often In The Wrong Direction
By Ed Sperling - 08 May, 2014 - Comments: 0

Every design these days, regardless of whether it’s a processor, an SoC, an ASIC, FPGA or stacked die, relies on a combination of re-used and third-party intellectual property. No company—not even Intel, Apple or Samsung—has the capability of building everything itself within a highly compressed market window. There is a spectrum of IP use and re-use, of course. In some cases, it may i... » read more

IP To Meet 2.5D Requirements
By Ann Mutschler - 08 May, 2014 - Comments: 1

The semiconductor industry is still in the early stages of evolution in the realm of 2.5D, but when these devices do come out, the IP used on them will have to be brand new, according to Javier DeLaCruz, senior director of engineering at eSilicon. “The IP causes the biggest risk that you’re going to have in this implementation,” he said. “Everything else in here for making those ASIC... » read more

Powerful Memories
By Brian Bailey - 07 May, 2014 - Comments: 1

Memory consumes more of the surface area of a die than any other component. So what changes have happened over the past few years to reduce the power consumption of memories, and where are the big opportunities for saving power? Let's take a closer look. A Growing Concern One of the key drivers for SoCs is the desire to reduce product costs, reduce form factors, reduce power, increase perfo... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy