tag: Rambus

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 15 Oct, 2021 - Comments: 0

Automotive Synopsys and 3D virtual-environment company Dassault Systèmes are collaborating on an automotive lighting system development platform. Synopsys’ optical design tools — LucidShape, LightTools, and CODE V — will be integrated with Dassault Systèmes' 3DEXPERIENCE Platform, which is used by automotive teams from different disciplines to work together on designs and simulations. ... » read more

HBM3: Big Impact On Chip Design
By Ann Mutschler - 14 Oct, 2021 - Comments: 0

An insatiable demand for bandwidth in everything from high-performance computing to AI training, gaming, and automotive applications is fueling the development of the next generation of high-bandwidth memory. HBM3 will bring a 2X bump in bandwidth and capacity per stack, as well as some other benefits. What was once considered a "slow and wide" memory technology to reduce signal traffic dela... » read more

Latency Considerations Of IDE Deployment On CXL Interconnects
By Paul Karazuba - 14 Oct, 2021 - Comments: 0

Certain applications and hardware types – emerging memory, artificial intelligence/machine learning (AI/ML), and cloud servers, to name a few – can realize significant performance advantages when a low latency interface is employed. However, traditional interconnects like PCI Express (PCIe) often do not offer low enough latencies required to optimize these applications. In response, the Com... » read more

Rising Fortunes For ICs In Health Care
By Susan Rambo - 13 Oct, 2021 - Comments: 0

Semiconductors are increasingly finding their way into a variety of medical devices, after years of slow growth and largely consumer electronics types of applications. Nearly every major chipmaker has a toehold in health care these days, and many are starting to look beyond wearable such as the Apple Watch to devices that can be relied on for accuracy and reliability. Unlike in the past, the... » read more

Manufacturing Bits: Oct. 11
By Mark LaPedus - 11 Oct, 2021 - Comments: 0

IC security using AFMs The National Institute of Standards and Technology (NIST) has developed a probe assisted doping technique (PAD), a technology that could help prevent counterfeit chips and electronic devices from entering the market. PAD involves creating a unique ID tag on every chip using an atomic force microscope (AFM). Basically, an AFM system incorporates a cantilever with a tin... » read more

Week In Review: Design, Low Power
By Jesse Allen - 08 Oct, 2021 - Comments: 0

Arteris IP plans to become a public company. It filed a registration statement with the SEC for an IPO, and intends to list on Nasdaq. The number of shares to be offered and the price range for the proposed offering have not yet been determined. Arteris IP provides network-on-chip interconnect IP, cache coherent interconnects, and packages to speed functional safety certification alongside IP d... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 08 Oct, 2021 - Comments: 0

Automotive Qualcomm and SSW Partners, an investment partnership, now have a definitive agreement to acquire advanced driver assistance systems (ADAS) company Veoneer for $37.00 per share in an all-cash transaction that equals $4.5 billion in equity value. A few months ago, Qualcomm made the proposal to Veoneer after the company already had an agreement in place with Magma, a 60-year-old automo... » read more

Competing Auto Sensor Fusion Approaches
By Bryon Moyer - 07 Oct, 2021 - Comments: 0

As today’s internal-combustion engines are replaced by electric/electronic vehicles, mechanical-system sensors will be supplanted by numerous electronic sensors both for efficient operation and for achieving various levels of autonomy. Some of these new sensors will operate alone, but many prominent ones will need their outputs combined — or “fused” — with the outputs of other sensor... » read more

Navigating The Seas Of FIPS 140-2 CMVP With Certified Root Of Trust And TRNG IP
By Bart Stevens - 07 Oct, 2021 - Comments: 0

No captain worth his salt would set sail without an experienced navigator at his side. Likewise, when navigating the FIPS 140-2 CMVP process, it’s extremely valuable to have a partner that has already successfully made the journey. More specifically, working with a partner that offers CMVP-certified IP can streamline the process and increase the success of achieving CMVP certification of chip... » read more

HBM3 Memory: Break Through To Greater Bandwidth
By Rambus - 06 Oct, 2021 - Comments: 0

AI/ML’s demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we’re on the verge of a new generation of HBM that will raise memory and capacity to new hei... » read more

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