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Demand, Lead Times Soar For 300mm Equipment


A surge in demand for various chips is causing select shortages and extended lead times for many types of 300mm semiconductor equipment, photomask tools, wafers, and other products. For the last several years, 200mm equipment has been in short supply in the market, but issues are now cropping up throughout the 300mm supply chain, as well. Traditionally, lead times have been three to six mont... » read more

NVM Reliability Challenges And Tradeoffs


This second of two parts looks at different memories and possible solutions. Part one can be found here. While various NVM technologies, such as PCRAM, MRAM, ReRAM and NRAM share similar high-level traits, their physical renderings are quite different. That provides each with its own set of challenges and solutions. PCRAM has had a fraught history. Initially released by Samsung, Micron, a... » read more

Deprocessing And SEM For Semiconductor Failure Analysis


A typical semiconductor is fabricated from metal and barrier layers separated by passivation layers. A further glassivation and/or polyimide layer on top of these provides environmental and mechanical protection. Optical microscopes By using optical microscopy, the semiconductor die can be inspected for failure modes such as top-down visible crack degradation, melt-down of metal conductors,... » read more